Indium 8.9HF1 Solder Paste PASTEOT-800595-500G Lead Free SAC305 | 500g, MOQ: 6
Indium 8.9HF1 — SAC305 No-Clean Solder Paste, Type 3, 500g Jar (PASTEOT-800595-500G) | MOQ: 6
Indium 8.9HF1 (part number PASTEOT-800595-500G) is a no-clean, halogen-free lead-free solder paste formulated with Indalloy 256 (SAC305 — Sn96.5/Ag3.0/Cu0.5) alloy and Type 3 powder. Specifically engineered to deliver outstanding voiding minimization for bottom-terminated components (BTCs) including QFNs and LGAs, the 8.9HF1 produces a soft, pliable post-reflow flux residue that provides unprecedented in-circuit testing (ICT) and flying-probe first-pass yields. Part of Indium Corporation's Avoid the Void® program. Supplied in 500g jars, minimum order quantity 6 jars.
Key Specifications
| Specification | Value |
|---|---|
| Part Number | PASTEOT-800595-500G |
| Flux Designation | Indium 8.9HF1 |
| Alloy | Indalloy 256 — SAC305 (Sn96.5/Ag3.0/Cu0.5) |
| Powder Type | Type 3 |
| Metal Load | 88.5% |
| Container | 500g jar |
| Flux Type | No-clean |
| Halogen Content | Halogen-free per EN14582 |
| Lead-Free | Yes — RoHS compliant |
| MOQ | 6 jars |
| Brand | Indium Corporation |
Key Features
- Outstanding BTC voiding minimization — engineered for Avoid the Void® performance under QFNs, LGAs, and other bottom-terminated components
- Soft post-reflow flux residue — enables high ICT and flying-probe first-pass yields, reducing false failures and rework
- High oxidation barrier — prevents graping and head-in-pillow (HiP) defects; improves coalescence of small deposits
- Excellent print transfer efficiency — consistent stencil printing for fine-pitch and high-density SMT applications
- Halogen-free — per EN14582 test method, meeting environmental and customer requirements
Frequently Asked Questions
What is the difference between Indium 8.9HF and 8.9HF1?
Both are SAC305 no-clean halogen-free solder pastes from Indium Corporation, but 8.9HF1 is specifically optimized for BTC voiding minimization and ICT/flying-probe first-pass yields through its soft, pliable post-reflow flux residue. The 8.9HF is a broader general-purpose formulation. If BTC voiding and ICT probe penetration are critical to your process, 8.9HF1 is the preferred choice.
Why does soft flux residue improve ICT first-pass yields?
In-circuit test (ICT) and flying-probe testers use spring-loaded probes that must penetrate the flux residue to make electrical contact with test points. Hard or thick flux residues can cause probe contact failures, resulting in false test failures and unnecessary rework. The soft, pliable residue of 8.9HF1 allows probes to penetrate easily, dramatically improving first-pass yields and reducing test cycle times.
What is the Avoid the Void® program?
Avoid the Void® is Indium Corporation's initiative focused on minimizing solder voids under bottom-terminated components (BTCs) such as QFNs, LGAs, and power devices. Voids reduce thermal and electrical performance of BTC joints. The 8.9HF1 is part of this program and is validated for low voiding performance under BTCs.
What is the minimum order quantity for PASTEOT-800595-500G?
The minimum order quantity (MOQ) for Indium 8.9HF1 PASTEOT-800595-500G is 6 jars (500g each = 3kg total). Contact MTE Solutions to confirm current pricing and lead time for your order quantity.
What storage and handling requirements apply to 8.9HF1?
Store refrigerated at 0–10°C. Allow jars to reach room temperature (approximately 4 hours) before opening and use. Do not accelerate warming. Refer to the Indium Corporation TDS for complete shelf life, storage, and handling requirements.
