Product Description:

Indium8.9HF Pb-free solder paste is halogen-free per the EN14582 test method. It is made with SAC305 and a Type 4 powder. Specifically designed to help Avoid the Void® , Indium8.9HF produces low-voiding results PLUS excellent stability. It also eliminates hot and cold slump, provides high oxidation resistance, and wets well to oxidized BGA and pad surfaces. Indium8.9HF also provides high transfer efficiency through small apertures and has excellent solder performance under high temperature and long reflow processes. This solder paste has a clear residue and is backward compatible with SnPb alloys.

• 8.9HF Flux
• Indalloy 256 (SAC305)
• No Clean
• Type 4
• 88.5% Metal
• Lead Free
• 500g Jar
• TECHNICAL DATA SHEET

Features:

• Halogen-free, Pb-free, no-clean
• High transfer efficiency with low variability
• Outstanding broadband print transfer
• Excellent response-to-pause performance<br>Unique resilient oxidation barrier technology
• Eliminates Head-in-Pillow (HiP) defects
• Eliminates graping defects and promotes complete coalescence
  Robust reflow capability
• Low-voiding with a vast array of thermal profiles and component styles
• Wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects
• Excellent pin-in-paste printability, solderability, and hole fill
• Clear, restricted, encapsulating flux reside with enhanced electrical reliability (SIR/ECM)
• Consistent lot-to-lot performance after storage and throughout the assembly process
• Backwards compatible with Sn/Pb alloys