Indium 8.9HF No-Clean Solder Paste SAC305 500g - Lead-Free Type 4 (PASTEOT-800495-500G)

Indium 8.9HF - SAC305 Lead-Free No-Clean Solder Paste 500g Type 4 (PASTEOT-800495-500G)

Industry-leading lead-free solder paste for high-reliability SMT assembly. Indium 8.9HF is a premium SAC305 lead-free solder paste with halogen-free, no-clean flux — the gold standard for RoHS-compliant electronics manufacturing. Type 4 powder delivers exceptional print definition for fine-pitch and ultra-fine-pitch components, while the 8.9HF flux chemistry provides outstanding wetting, minimal voiding, and a wide reflow process window.

PRODUCT SPECIFICATIONS
• SKU: PASTEOT-800495-500G
• Alloy: SAC305 (96.5% Sn / 3.0% Ag / 0.5% Cu) - Lead-Free
• Powder Size: Type 4 (20-38 micron)
• Flux Type: No-Clean, Halogen-Free
• Package Size: 500 gram jar
• Shelf Life: 6 months refrigerated (2-10°C)
• Manufacturer: Indium Corporation

KEY FEATURES & BENEFITS
✓ SAC305 Lead-Free Alloy - RoHS compliant for global markets
✓ Halogen-Free Flux - Environmentally responsible formulation
✓ No-Clean - Minimal residue, no post-reflow cleaning required
✓ Type 4 Powder - Superior print definition for fine-pitch components
✓ Low Voiding - Excellent for BGA and QFN applications
✓ Wide Process Window - Forgiving reflow profile tolerance
✓ Extended Tack Time - Maintains component placement stability

IDEAL APPLICATIONS
• Fine-pitch SMT assembly (0402, 0201, 01005)
• Ball grid array (BGA) packages
• QFN and LGA components
• Chip-scale packages (CSP)
• High-reliability RoHS-compliant electronics
• Consumer, industrial, and automotive electronics

SAC305 ALLOY PROPERTIES
• Tin (Sn): 96.5%
• Silver (Ag): 3.0%
• Copper (Cu): 0.5%
• Melting Point: 217-220°C (423-428°F)
• RoHS Compliant: Yes

COMPLIANCE
• RoHS Compliant
• Halogen-Free (<900ppm Cl, <900ppm Br)
• J-STD-004 & J-STD-005 Tested