Indium 8.9HF SAC305 Lead-Free Solder Paste 500g - No Clean Type 4 (MOQ: 6)
Indium 8.9HF SAC305 Lead-Free Solder Paste 500g – No Clean Type 4 (MOQ: 6)
Indium 8.9HF is a halogen-free, no-clean solder paste formulated with SAC305 alloy for RoHS-compliant SMT assembly. It delivers exceptional print definition, extended tack time, and low voiding on BGA and QFN packages — making it the production-volume choice for fine-pitch and high-reliability electronics manufacturing.
Sold in packs of 6 (minimum order) — 500g jars.
Specifications
| SKU | PASTEOT-800494-500G |
| Alloy | SAC305 (96.5Sn / 3.0Ag / 0.5Cu) – Lead-Free |
| Powder Size | Type 4 (20–38 micron) |
| Flux Type | No-Clean, Halogen-Free (8.9HF) |
| Metal Content | 89% |
| Package | 500g jar |
| Minimum Order Quantity | 6 jars (3kg total) |
| Shelf Life | 6 months refrigerated (2–10°C) |
| Compliance | RoHS, REACH, Halogen-Free (<900ppm Cl/Br), J-STD-004, J-STD-005 |
| Manufacturer | Indium Corporation |
Frequently Asked Questions
Why does this product have a minimum order quantity of 6?
Solder paste has a 6-month refrigerated shelf life. The MOQ of 6 jars (3kg total) is set to align with typical production consumption rates and ensure you receive fresh product. For lower-volume needs, consider the 600g cartridge version (PASTEOT-800495-600G), which is sold individually.
What is the difference between the 500g jar and the 600g cartridge?
The 500g jar is designed for use with a spatula or manual dispensing in open-jar printing processes. The 600g Semco cartridge is designed for pneumatic or automated paste dispensers. Both use the same 8.9HF flux chemistry and SAC305 alloy.
Does Indium 8.9HF require post-reflow cleaning?
No. As a no-clean formulation, the flux residue left after reflow is minimal, non-corrosive, and electrically safe — no cleaning step is required for most applications. If your process requires cleaning, Indium's water-wash paste lines (3.2 or 3.2HF) are the appropriate alternative.
What fine-pitch components is this paste qualified for?
The Type 4 powder size (20–38 micron) supports stencil printing down to 0.4mm pitch, including 0201, 0402, and 0603 passives, as well as BGA, CSP, and QFN packages. It is widely used in automotive, medical, and aerospace SMT assembly lines.
