Chemtronics SW18015 Soder-Wick Rosin Flux Desoldering Wick, 0.8mm, 5ft, 25 Bobbins
Chemtronics SW18015 Soder-Wick® Rosin Flux Desoldering Wick — Size #1, 0.8mm | 5ft Bobbins, 25/Pack
Chemtronics Soder-Wick® Rosin is the industry benchmark for desoldering wick — trusted in electronics assembly, rework, and repair for fast, clean solder removal. The SW18015 is Size #1 (0.8mm wide), the finest width in the Soder-Wick Rosin line, optimized for SMD rework, fine-pitch IC pads, and tight-tolerance desoldering where larger braid would bridge adjacent pads. Built on lightweight, pure copper braid construction for superior thermal conductivity at low iron temperatures, Soder-Wick responds faster than conventional desoldering braids, minimizing heat soak and reducing the risk of PCB damage or component stress.
Flux type is noncorrosive, ultra-high-purity Type R rosin — the fastest wicking flux available. Note: rosin flux leaves residues that should be cleaned after rework. Chemtronics Flux-Off Rosin flux remover is the recommended companion cleaner. Each bobbin contains 5ft of wick; cases contain 25 bobbins.
Specifications
| Part Number | SW18015 |
|---|---|
| Brand | Chemtronics |
| Series | Soder-Wick® Rosin |
| Size | #1 — 0.8mm (0.030") wide |
| Color | White/Gray |
| Length per Bobbin | 5 ft |
| Bobbins per Case | 25 |
| Flux Type | Type R Rosin (noncorrosive, ultra-high-purity) |
| Braid Material | Pure copper (lightweight construction) |
| Flux Standard | MIL-F-14256 Type R; ANSI/IPC J-STD-004 Type ROL0 |
| Industry Standards | NASA-STD-8739.3; DOD-STD-883E Method 2022 |
| Ionic Contamination | Will not leave ionic contamination on boards |
| Post-Clean Required | Yes — rosin residue should be removed after use |
Soder-Wick Rosin Size Guide
| Part Number | Size | Width | Best For |
|---|---|---|---|
| SW18015 | #1 | 0.8mm (0.030") | SMD, fine-pitch ICs, tight pad spacing — this listing |
| SW18025 | #2 | 1.5mm (0.060") | General SMD rework, small through-hole |
| SW18035 | #3 | 2.0mm (0.080") | Standard through-hole, larger pads |
| SW18045 | #4 | 2.8mm (0.110") | Large through-hole, connectors |
| SW18055 | #5 | 3.7mm (0.145") | Heavy joints, large pins, ground planes |
Key Features
- Fastest wicking action — Type R rosin flux delivers the fastest solder uptake of any flux type; ideal for high-throughput rework
- Lightweight pure copper braid — lower mass means better thermal conductivity at reduced iron temperatures, minimizing heat damage to PCB and components
- Size #1 / 0.8mm — finest standard width; designed for SMD rework, fine-pitch QFP/BGA pad cleanup, and tight-tolerance desoldering where larger braid would bridge pads
- MIL-F-14256 Type R / IPC J-STD-004 ROL0 — meets military and IPC standards for rosin flux; suitable for defense and aerospace electronics rework
- NASA and DOD qualified — per NASA-STD-8739.3 and DOD-STD-883E Method 2022
- No ionic contamination — will not leave ionic residues that cause corrosion or leakage current
- 5ft bobbins, 25/pack — convenient bobbin format for bench use; easy to dispense and cut
Applications
- SMD rework and fine-pitch IC desoldering — QFP, SOIC, 0402/0603 component removal
- PCB repair — removing solder bridges, cold joints, and excess solder from pads
- Electronics prototyping — clean component removal during design iteration
- Defense and aerospace electronics rework — MIL-spec and NASA-qualified flux
- Contract electronics manufacturing — high-volume desoldering and touch-up rework
Frequently Asked Questions
What is the difference between Soder-Wick Rosin and Soder-Wick No-Clean?
Soder-Wick Rosin uses Type R rosin flux for the fastest wicking action and most aggressive solder pickup — ideal when speed is the priority and post-clean is part of your process. Soder-Wick No-Clean uses a low-residue no-clean flux that can be left on the board without cleaning in most applications, trading some wicking speed for process convenience. Use Rosin when maximum wicking performance is needed; use No-Clean when your process skips post-clean.
Do I need to clean the board after using Soder-Wick Rosin?
Yes — rosin flux leaves visible residues that should be removed after rework. Chemtronics Flux-Off Rosin flux remover is the recommended cleaner and is available at MTE Solutions. Leaving rosin residue on the board is generally acceptable for low-frequency or non-critical circuits but can cause issues in high-impedance, high-frequency, or humid environments.
What size Soder-Wick should I use for SMD rework?
For SMD rework on fine-pitch components (QFP, SOIC, 0402/0603), Size #1 (SW18015, 0.8mm) is the correct choice — it’s narrow enough to target individual pads without bridging adjacent ones. For larger SMD components or standard through-hole work, Size #2 (SW18025, 1.5mm) or Size #3 (SW18035, 2.0mm) are more efficient.
Is Soder-Wick Rosin suitable for military and aerospace electronics?
Yes — Soder-Wick Rosin meets MIL-F-14256 Type R flux, NASA-STD-8739.3, and DOD-STD-883E Method 2022 requirements, making it suitable for defense and aerospace electronics rework where qualified flux materials are specified.
What is the IPC classification for Soder-Wick Rosin flux?
ANSI/IPC J-STD-004 Type ROL0 — rosin-based (RO), low activity (L), no halide content (0). This is the standard classification for noncorrosive rosin flux suitable for most electronic assemblies.
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