Lead Free Solder Paste, Sac305, No Clean 25 G (0.88 Oz)

MG Chemicals SKU: 4900P-25G
Lead Free Solder Paste, Sac305, No Clean 25 G (0.88 Oz)
Lead Free Solder Paste, Sac305, No Clean 25 G (0.88 Oz)

Lead Free Solder Paste, Sac305, No Clean 25 G (0.88 Oz)

MG Chemicals SKU: 4900P-25G
Regular price $23.95
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Shipping calculated at checkout.
4900P - SAC305 NO CLEAN SOLDER PASTE The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces. Applications & Usages The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm. Catalog Number Sizes Available Description 4900P-25G 25 g (0.88 oz) Syringe 4900P-250G 250 g (8.81 oz) Jar Features Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B Repeatable and consistent print characteristics Long stencil and tack life to accommodate high speed printing Excellent wettability Suitable for air or nitrogen atmosphere Medium soft, non-cracking residues Dobb-Frank (DRC conflict free) REACH (compliant) RoHS (compliant) Technical Data Sheet
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