MG Chemicals 4900P-25G, Lead-Free Solder Paste, SAC305, No-Clean
MG Chemicals 4900P-25G, Lead-Free Solder Paste, SAC305, No-Clean
MG Chemicals 4900P is a halogen-free, lead-free SAC305 no-clean solder paste engineered for ultra-fine pitch printing down to 0.3mm stencil apertures. It delivers brick-like prints at high speed, excellent wetting on copper OSP coatings, and smooth solder joint surfaces — available in a 25g (0.88 mL) syringe. Must be kept refrigerated.
Product Specifications
| Specification | Value |
|---|---|
| Part Number | 4900P-25G |
| Manufacturer | MG Chemicals |
| Alloy | SAC305 (Sn96.5/Ag3/Cu0.5) |
| Flux Type | No-Clean |
| Halogen Content | Halogen-Free |
| Lead Content | Lead-Free (RoHS Compliant) |
| Net Weight | 25g |
| Net Volume | 0.88 mL |
| Packaging | Syringe |
| Minimum Stencil Aperture | 0.3mm (ultra-fine pitch) |
| Alloy Standard | J-STD-006C / ASTM B 32 |
| Flux Standard | J-STD-004B |
| Storage | Keep Refrigerated |
Key Features & Benefits
- Ultra-Fine Pitch Capability — Prints reliably through stencil apertures as small as 0.3mm, delivering brick-like prints even at high speeds
- Halogen-Free & Lead-Free — Meets RoHS requirements; safe for environmentally sensitive applications
- Excellent OSP Wetting — Superior wettability on copper OSP-coated boards for reliable joint formation
- Long Stencil & Tack Life — Extended open time supports high-speed production printing without paste degradation
- Wide Reflow Process Window — High thermal stability accommodates process variation while maintaining joint quality
- Smooth, Non-Cracking Residues — Medium-soft residues that won’t crack or cause inspection issues; no-clean formula eliminates post-reflow cleaning
- Air or Nitrogen Compatible — Suitable for both standard air reflow and nitrogen atmosphere processes
Typical Applications
- Ultra-fine pitch SMD component placement and reflow
- High-speed automated stencil printing in SMT production
- Prototype and low-volume PCB assembly
- Boards with copper OSP surface finish
- Lead-free RoHS-compliant electronics manufacturing
Frequently Asked Questions
Does MG Chemicals 4900P need to be cleaned after reflow?
No — it is a no-clean formula. Residues are medium-soft and non-cracking, and do not require post-reflow cleaning in most applications. Verify compatibility with your specific process and inspection requirements.
What is the minimum stencil aperture for 4900P?
It is designed for ultra-fine pitch applications and can print reliably through stencil apertures as small as 0.3mm, making it suitable for demanding fine-pitch SMD assembly.
Is this paste RoHS compliant?
Yes — 4900P uses a SAC305 (Sn96.5/Ag3/Cu0.5) lead-free alloy that meets RoHS requirements. It is also halogen-free.
How should 4900P be stored?
It must be kept refrigerated. Allow the paste to reach room temperature before use — typically 2–4 hours out of refrigeration — without opening the container to prevent condensation.
What sizes does MG Chemicals 4900P come in?
This listing is for the 25g (0.88 mL) syringe. Contact MTE Solutions for availability of larger jar sizes or bulk quantities.
