MG Chemicals 4900P, Lead Free Solder Paste, SAC305, No-Clean
4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent printing characteristics
- Long stencil and tack life facilitate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmospheres
- Medium-soft, non-cracking residues
Technical Data Sheet
Safety Data Sheet
*Keep Refrigerated
| Part # |
Net Vol. |
Net Wt. |
Packaging |
| 4900P-25G |
0.88 mL |
25 g |
Syringe |
| 4900P-250G |
8.81 mL |
250 g |
Jar |
