Kester NXG1 Solder Paste 7032130810 | SAC305 Lead-Free No-Clean ROL1 | 500g Jar | Case of 10
Kester NXG1 Solder Paste 7032130810 | SAC305 Lead-Free No-Clean ROL1 | 500g Jar | Case of 10
Kester NXG1 7032130810 is a SAC305 lead-free, no-clean solder paste for stencil printing, supplied as a case of ten 500g jars. This part number uses Type 3 powder and 88.5% metal loading. Its ROL1 flux formulation supports air or nitrogen reflow and is designed for smooth solder joints with light-colored residues.
Ordering format: case of 10 × 500g jars, 5kg total. Overnight shipping is specified for this listing.
Best Uses / Applications
For electronics manufacturers and EMS providers evaluating SAC305 stencil-printing processes, especially production with interruptions where response-to-pause matters. Kester reports effective first prints on 0.4 mm pitch QFPs after printing pauses of up to 120 minutes. These are manufacturer-described capabilities, not guarantees for every stencil or assembly. Validate aperture design, paste release, reflow, and residue acceptance on your equipment.
Key Features
- Type 3 SAC305 formulation for compatible standard and fine-pitch stencil-printing applications.
- No-clean ROL1 flux, classified under IPC J-STD-004B.
- Manufacturer-reported long stencil and tack life, both process dependent.
- Air or nitrogen reflow capability with smooth, shiny joints and light-colored residues.
- Eight-month shelf-life guidance under the stated refrigerated handling conditions.
Technical Specifications
| Part number | 7032130810 |
|---|---|
| Manufacturer / family | Kester / NXG1 |
| Alloy | SAC305, Sn96.5/Ag3.0/Cu0.5 |
| Powder | Type 3, 25–45 µm |
| Metal loading | 88.5% by weight |
| Flux | No-clean, ROL1 under IPC J-STD-004B |
| Package | 500g jar; sold as case of 10 jars |
| Reflow atmosphere | Air or nitrogen |
| Print speed guidance | 25–200 mm/s in manufacturer TDS; validate for the process |
| Pause / restart guidance | Up to 120-minute printing breaks, manufacturer-described |
| Fine-pitch example | 0.4 mm pitch QFP printing; not a universal minimum pitch |
| Storage / shelf life | 0–10°C; eight months from manufacture when properly handled, per manufacturer TDS |
Handling and Process Guidance
Follow the applicable lot label and current technical documentation. Stabilize paste at room temperature before printing. Set the reflow profile for the actual board and components. No-clean does not mean residue-free or universally exempt from cleaning: qualify residue acceptance and any required removal process for the application. Follow the product SDS and warning label.
How to Compare NXG1 with Other Pastes
| Comparison point | What to verify |
|---|---|
| Same SAC305 alloy | Also compare powder, flux, metal loading, packaging, and working-life conditions. |
| ROL1 versus another flux code | Read the applicable standard revision and manufacturer tests; do not rank reliability from the code alone. |
| Type 3 versus finer powder | Match the smallest aperture and stencil geometry rather than automatically choosing the finer powder. |
| Eight-month shelf life | Compare storage conditions and manufacture/expiry dates, not unsupported longest-in-class claims. |
Frequently Asked Questions
Is this one jar or a case?
This listing is a case of ten 500g jars, totaling 5kg.
What powder and metal loading apply to 7032130810?
Kester's part-number documentation identifies Type 3 powder and 88.5% metal loading for this SAC305 500g jar.
Does NXG1 require cleaning after reflow?
It is no-clean. Whether residue may remain depends on the qualified assembly and customer requirements; validate cleaning if removal is required.
Does a 120-minute pause claim guarantee the next print?
No. It is a manufacturer-described capability. Ambient conditions, stencil design, and production setup affect restart performance.
What is the shelf life?
The manufacturer TDS specifies eight months from manufacture at 0–10°C when handled properly. Check the applicable lot label and instructions.
Can it reflow in air or nitrogen?
Yes. Kester lists both atmospheres. Validate the profile on your assembly.
Related Resources
Compare solder pastes | Soldering, Desoldering & Rework guide
Technical references: Kester NXG1 manufacturer technical data sheet and manufacturer part-number listing. Confirm applicable revisions before production use.
