Kester NXG1 Solder Paste 7032130810 | SAC305 Lead-Free No-Clean ROL1 | 500g Jar | Case of 10

Kester NXG1 Solder Paste — 7032130810 | SAC305 Lead-Free No-Clean ROL1 | 500g Jar | Case of 10

Kester NXG1 (SKU: 7032130810) is a lead-free, no-clean solder paste formulated with SAC305 alloy (96.5Sn/3.0Ag/0.5Cu) for use in both air and nitrogen reflow atmospheres. NXG1 is engineered to handle the thermal requirements of lead-free alloys while producing reflowed joint appearances that closely resemble SnPb solder — smooth, shiny solder joints with light-colored residues. NXG1 features the longest shelf life of any product in its class at 8 months, and supports stencil printing downtimes up to 120 minutes with effective first-print results down to 0.4mm (16mil) pitch QFPs. Classified ROL1 per IPC ANSI/J-STD-004B and compliant with ANSI/J-STD-005. Sold as a case of 10 × 500g jars. Ships overnight due to refrigeration requirements.

Key Specifications

Key Features

• 8-month shelf life — longest in its class — significantly reduces paste waste from expired inventory; ideal for lower-throughput production lines, prototyping facilities, and operations with variable production schedules
• 120-minute stencil downtime — paste remains printable for up to 2 hours of idle time, reducing waste and increasing process flexibility during production pauses or shift changes
• SnPb-like joint appearance — smooth, shiny solder joints with light-colored residues; simplifies visual inspection and QA for teams transitioning from leaded to lead-free processes
• 0.4mm pitch QFP capable — effective first-print results on fine-pitch components without aperture optimization required
• Air and nitrogen compatible — performs in both reflow atmospheres; nitrogen can further improve wetting and joint appearance on demanding assemblies
• ROL1 no-clean flux — IPC ANSI/J-STD-004B classified; low residue, no post-reflow cleaning required in most applications
• Case of 10 × 500g jars — jar format suited for open-jar stencil printing; case quantity optimizes refrigerated shipping and production inventory

Frequently Asked Questions

What is the difference between Kester NXG1 (ROL1) and NP505-HR (ROL0)?
NP505-HR is zero-halogen and ROL0 classified — designed for the most stringent high-reliability applications (automotive, aerospace, medical). NXG1 is ROL1 — a no-clean paste optimized for broad production use with an industry-leading 8-month shelf life, 120-minute stencil downtime, and SnPb-like joint aesthetics. Choose NP505-HR for zero-halogen high-reliability requirements; choose NXG1 for superior process flexibility and shelf life in standard lead-free production.

What makes NXG1's shelf life exceptional?
At 8 months refrigerated, NXG1 has the longest shelf life in its product class — significantly longer than the 6-month standard for most solder pastes. This reduces expired paste waste, lowers inventory management burden, and is particularly advantageous for lower-volume or variable production schedules where paste is consumed more slowly.

Can NXG1 print 01005 components?
NXG1 is validated for 0.4mm pitch QFP printing. For 01005 components, consider Kester NP505-HR or other Type 4/Type 5 ultra-fine-pitch formulations. Contact MTE Solutions at 651-600-3838 for application guidance.

Does NXG1 require post-reflow cleaning?
No — NXG1 is a no-clean formulation (ROL1). Residues are low-volume, light-colored, and electrically safe. No post-reflow cleaning is required in most standard applications.

Is NXG1 compatible with nitrogen reflow?
Yes — NXG1 is designed for use in both air and nitrogen reflow atmospheres. Nitrogen can further improve wetting and joint appearance, particularly for demanding assemblies or oxidation-sensitive components.

Why does solder paste require overnight shipping?
Solder paste is temperature-sensitive and must be shipped and stored refrigerated to preserve flux activity, viscosity, and shelf life. Refrigerate immediately upon receipt and allow to reach ambient temperature before use.