Indium NC-SMQ92J Solder Paste PASTEOT-82453-500G | 63Sn/37Pb No-Clean Type 3 | 500g Jar | MOQ: 8
Indium NC-SMQ92J Solder Paste — PASTEOT-82453-500G | 63Sn/37Pb No-Clean Type 3 | 500g Jar | MOQ: 8
Indium NC-SMQ92J (SKU: PASTEOT-82453-500G) is a halogen-free, no-clean solder paste in a 500g jar format, formulated with 63Sn/37Pb eutectic alloy (Indalloy 106) and Type 3 powder. Designed for high-volume SMT stencil printing, NC-SMQ92J delivers excellent print definition, extended tack time, and consistent solder joint reliability across fine-pitch and standard SMT components. The eutectic 63/37 alloy provides a sharp 183°C melting point for predictable reflow behavior. Post-reflow residue is benign and probe-testable — will not clog multi-point ICT probes. Minimum order quantity: 8 jars. Ships overnight only due to refrigeration requirements.
Key Specifications
| Specification | Value |
|---|---|
| Part Number / SKU | PASTEOT-82453-500G |
| Product Line | NC-SMQ92J |
| Alloy | 63Sn/37Pb (Indalloy 106, eutectic tin-lead) |
| Powder Type | Type 3 (25–45μm) |
| Flux Type | No-Clean (ROL0 / Halide-free) |
| Halogen Content | Halogen-free |
| Reflow Atmosphere | Air |
| Container | 500g jar |
| Shelf Life | 6 months refrigerated (0–10°C) |
| Minimum Order Quantity | 8 jars |
| Compliance | ANSI/J-STD-004, J-STD-005, Bellcore |
| RoHS | Not RoHS compliant (contains lead) |
| Brand | Indium Corporation |
| Shipping Requirement | Overnight only (temperature-sensitive) |
Key Features
- Eutectic 63/37 alloy — sharp 183°C melting point for predictable, consistent reflow behavior across diverse PCB assemblies
- Type 3 powder (25–45μm) — reliable paste deposition for fine-pitch components including 0402, 0603, 0805, BGA, and CSP packages
- Probe-testable no-clean residue — benign post-reflow residue easily penetrated by multi-point ICT probes; cleaning not required on most assemblies
- Halogen-free formulation — meets ANSI/J-STD-004 and Bellcore halide-free criteria for high-reliability and environmentally sensitive manufacturing
- Extended tack time — maintains component placement stability during high-mix, high-speed SMT production runs
- Excellent air reflow wetting — superior wetting in standard air reflow ovens without nitrogen atmosphere
- Wide process window — forgiving reflow profile tolerance for robust production across varying thermal conditions
- Leaded for exemption applications — suitable for military, aerospace, and medical electronics where RoHS lead exemptions apply
Download Indium NC-SMQ92J Technical Data Sheet (TDS)
Frequently Asked Questions
What is the MOQ for PASTEOT-82453-500G and why?
The minimum order quantity is 8 jars (500g each = 4.0kg total). The MOQ ensures fresh product from the manufacturing lot and reflects the refrigerated shipping and handling economics of solder paste. Contact MTE Solutions at 651-600-3838 to discuss your specific order requirements.
Is NC-SMQ92J PASTEOT-82453-500G RoHS compliant?
No — NC-SMQ92J PASTEOT-82453-500G contains lead (63Sn/37Pb) and is not RoHS compliant. It is intended for applications where leaded solder is permitted or required, including military, aerospace, and medical electronics operating under RoHS lead exemptions. For lead-free production, see Indium 8.9HF SAC305 solder paste options.
What is the difference between PASTEOT-82453-500G and PASTEOT-83495 (also 500g)?
Both are NC-SMQ92J 63/37 no-clean solder paste in 500g format. PASTEOT-82453-500G has an MOQ of 8 and is typically sold in case quantities. PASTEOT-83495 is available in lower quantities. The flux formulation and alloy are the same. Contact MTE Solutions to confirm current stock and best ordering option for your volume.
Does NC-SMQ92J require cleaning after reflow?
No — NC-SMQ92J is a no-clean formulation. Post-reflow residue is benign, non-corrosive, and probe-testable for ICT. If conformal coating will be applied over the residue, consult the Indium NC-SMQ92J TDS for coating compatibility guidance.
Why does solder paste require overnight shipping?
Solder paste is temperature-sensitive and must be shipped and stored refrigerated (0–10°C) to preserve flux activity, viscosity, and shelf life. Refrigerate immediately upon receipt and allow to reach room temperature before opening and use.
What fine-pitch components is Type 3 NC-SMQ92J suitable for?
Type 3 powder (25–45μm) is suitable for 0402, 0603, and 0805 passives, fine-pitch QFP and SOP packages, BGA and CSP components with standard ball pitch, and most standard SMT stencil apertures. For very fine-pitch components requiring smaller apertures, Type 4 (20–38μm) may be required.
