Indium 8.9HF Solder Paste PASTEOT-801526-600G | SAC305 Lead-Free No-Clean Type 6 | 600g Cartridge | Low Void

Indium 8.9HF Solder Paste — PASTEOT-801526-600G | SAC305 Lead-Free No-Clean Type 6 | 600g Cartridge | Low Void

Indium8.9HF (SKU: PASTEOT-801526-600G) is a halogen-free, no-clean lead-free solder paste formulated with SAC305 (96.5Sn/3.0Ag/0.5Cu) at 88.5% metal load and Type 6 ultra-fine powder, packaged in a 600g cartridge. Type 6 powder (5–15μm) is the finest commercially available solder paste powder, required for 01005 components, ultra-fine-pitch ICs, and advanced packaging where smaller stencil apertures demand tighter powder particle control. 8.9HF delivers low voiding, excellent stencil life, and high oxidation resistance for high-reliability SMT assembly. Supplied in a 600g cartridge for pneumatic paste dispensing. Ships overnight only due to refrigeration requirements.

Key Specifications

Key Features

• Type 6 ultra-fine powder (5–15μm) — finest commercially available solder paste powder; required for 01005 components, ultra-fine-pitch ICs, and advanced packaging with apertures below 0.4mm pitch
• Low voiding formulation — minimizes voids under BGA and QFN pads for improved thermal conductivity and electrical reliability in high-performance assemblies
• SAC305 lead-free alloy — 96.5Sn/3.0Ag/0.5Cu; RoHS and REACH compliant for all standard lead-free electronics manufacturing markets
• Halogen-free no-clean flux (ROL0) — no post-reflow cleaning required; clear residue with excellent electrical reliability (SIR/ECM tested)
• High oxidation resistance — wets well to oxidized BGA and pad surfaces; consistent performance under high-temperature and long reflow profiles
• Excellent stencil life — consistent print quality over extended production runs; suited for high-mix and multi-shift SMT environments
• 600g cartridge format — controlled, consistent paste deposition via pneumatic dispensing; critical for Type 6 ultra-fine-pitch printing where print consistency is paramount

Frequently Asked Questions

What is the difference between Type 4, Type 5, and Type 6 solder paste powder?
Powder type refers to particle size distribution. Type 4 (20–38μm) is standard for most SMT including 0201 components. Type 5 (15–25μm) is used for finer pitch and smaller components. Type 6 (5–15μm) is the finest commercially available powder, required for 01005 components, ultra-fine-pitch ICs, and advanced packaging where small stencil apertures demand tighter particle control for consistent printing and reflow.

Why is 8.9HF Type 6 supplied in a cartridge and not a jar?
The 600g cartridge provides more controlled, consistent paste deposition via pneumatic dispensing — critical for Type 6 ultra-fine-pitch applications where print volume consistency directly impacts yield. Jar formats are available for Type 3 and Type 4 powder versions of 8.9HF.

What voiding performance does 8.9HF Type 6 achieve?
Indium8.9HF is engineered for low voiding under area-array components. Actual voiding results depend on reflow profile, pad design, and component type. Contact MTE Solutions at 651-600-3838 or Indium Corporation for application-specific voiding data.

Is Indium 8.9HF compatible with nitrogen reflow?
Yes — 8.9HF performs well in both air and nitrogen reflow. Nitrogen can further improve wetting and reduce oxidation, beneficial for the most demanding ultra-fine-pitch applications. Refer to the Indium8.9HF TDS for recommended reflow profiles.

What is the shelf life and storage requirement?
Store refrigerated at <10°C. Shelf life is 6 months unopened. Allow cartridge to reach ambient temperature (minimum 2 hours) before use. Label cartridges with date and time of opening.

Why does solder paste require overnight shipping?
Solder paste is temperature-sensitive and must be shipped and stored refrigerated to preserve flux activity, viscosity, and shelf life. Refrigerate immediately upon receipt.