Indium 6.6HF SAC305 Lead-Free Solder Paste 600g - No Clean Type 4

Indium 6.6HF - SAC305 Lead-Free No-Clean Solder Paste 600g Type 4

Premium lead-free solder paste for high-reliability SMT assembly. Indium 6.6HF is a halogen-free, no-clean solder paste formulated with SAC305 (96.5Sn/3.0Ag/0.5Cu) alloy for RoHS-compliant electronics manufacturing. This Type 4 powder solder paste delivers exceptional print definition, tack time, and solder joint reliability for fine-pitch components, BGA, and CSP applications.

PRODUCT SPECIFICATIONS
• SKU: PASTEOT-801641-600G
• Alloy: SAC305 (96.5Sn/3.0Ag/0.5Cu) - Lead-Free
• Powder Size: Type 4 (20-38 micron)
• Flux Type: No-Clean, Halogen-Free
• Viscosity: 6.6 (medium viscosity for versatile printing)
• Package Size: 600 gram cartridge
• Minimum Order Quantity: 5 cartridges
• Shelf Life: 6 months refrigerated (2-10°C)
• Manufacturer: Indium Corporation

KEY FEATURES & BENEFITS
✓ Halogen-Free No-Clean Flux - Minimal post-reflow residue, eliminates cleaning
✓ Excellent Print Definition - Type 4 powder for fine-pitch components down to 0201
✓ Extended Tack Time - Maintains component placement stability
✓ Superior Wetting - Consistent solder joint formation across all pad finishes
✓ Low Voiding - <5% voiding on BGA and QFN packages
✓ RoHS & REACH Compliant - Meets all environmental regulations
✓ Wide Process Window - Forgiving reflow profile tolerance
✓ J-STD-004 & J-STD-005 Tested - Meets IPC industry standards

IDEAL APPLICATIONS
• Surface mount technology (SMT) assembly
• Fine-pitch components (0201, 0402, 0603)
• Ball grid array (BGA) packages
• Chip-scale packages (CSP)
• Quad flat no-lead (QFN) packages
• Flip-chip assembly
• High-reliability electronics (automotive, medical, aerospace)
• Consumer electronics manufacturing
• LED assembly
• Power electronics

TECHNICAL PERFORMANCE
Printing Performance:
Indium 6.6HF's Type 4 powder size and optimized rheology deliver exceptional stencil printing performance. The paste releases cleanly from fine-pitch stencil apertures while maintaining excellent brick definition and minimal slump. Medium viscosity (6.6) provides versatility across different stencil thicknesses and aperture sizes.

Tack Time & Component Placement:
Extended tack time ensures components remain in place during board handling and transport to reflow. This is critical for high-mix, low-volume production where boards may sit between printing and reflow.

Reflow Characteristics:
SAC305 alloy melts at 217-220°C, providing a robust process window for lead-free reflow profiles. The no-clean flux activates properly across a wide temperature range, ensuring consistent wetting and intermetallic formation.

Voiding Performance:
Halogen-free formulation minimizes outgassing during reflow, resulting in <5% voiding on thermal pads and BGA balls. This is essential for power components and packages requiring optimal thermal and electrical conductivity.

SAC305 ALLOY COMPOSITION
• Tin (Sn): 96.5%
• Silver (Ag): 3.0%
• Copper (Cu): 0.5%

SAC305 is the industry-standard lead-free alloy, offering excellent mechanical strength, thermal cycling reliability, and compatibility with all common PCB surface finishes (ENIG, OSP, ImAg, HASL).

NO-CLEAN FLUX CHEMISTRY
Halogen-free, no-clean flux formulation provides:
• Minimal post-reflow residue (clear, non-tacky)
• No cleaning required for most applications
• Excellent electrical insulation resistance
• Passes SIR (Surface Insulation Resistance) testing
• Compatible with conformal coating and underfill processes
• Low ionic contamination

COMPATIBLE SURFACE FINISHES
✓ ENIG (Electroless Nickel Immersion Gold)
✓ OSP (Organic Solderability Preservative)
✓ ImAg (Immersion Silver)
✓ ImSn (Immersion Tin)
✓ HASL (Hot Air Solder Leveling)
✓ Lead-free HASL
✓ Bare copper

REFLOW PROFILE RECOMMENDATIONS
• Preheat: 150-180°C for 60-120 seconds
• Soak: 150-200°C for 60-120 seconds
• Peak Temperature: 235-250°C
• Time Above Liquidus (217°C): 60-90 seconds
• Cooling Rate: <4°C/second

Consult Indium Corporation's technical datasheet for detailed reflow profile guidance.

STORAGE & HANDLING
• Storage Temperature: 2-10°C (refrigerated)
• Shelf Life: 6 months from manufacture date when refrigerated
• Warm-Up Time: Allow 4-8 hours at room temperature before use
• Stir Before Use: Mix paste thoroughly before dispensing into printer
• Stencil Life: 8+ hours on stencil (depending on environment)
• Packaging: 600g cartridge (compatible with standard dispensing equipment)

COMPLIANCE & CERTIFICATIONS
✓ RoHS Compliant - Restriction of Hazardous Substances Directive
✓ REACH Compliant - European chemicals regulation
✓ Halogen-Free - <900ppm Cl, <900ppm Br, <1500ppm total
✓ J-STD-004 - Requirements for Soldering Fluxes
✓ J-STD-005 - Requirements for Soldering Pastes
✓ IPC-TM-650 - Test methods compliance
✓ ISO 9001 - Manufactured under quality management system

MINIMUM ORDER QUANTITY
This product has a minimum order quantity of 5 cartridges (600g each) = 3kg total. This ensures fresh product and optimal performance while meeting typical production consumption rates.

WHY CHOOSE INDIUM 6.6HF?
Proven Reliability: Indium Corporation has over 85 years of experience in solder paste formulation. The 6.6HF is trusted by tier-1 electronics manufacturers worldwide for high-reliability applications.

Technical Support: Indium Corporation provides world-class technical support including process optimization, failure analysis, and reflow profile development.

Consistent Quality: Every batch is tested to ensure consistent viscosity, metal content, flux activity, and printing performance.

TECHNICAL SPECIFICATIONS TABLE

Download Technical Datasheet (PDF)

Indium Corporation - Global leader in solder paste, solder preforms, and specialty materials for electronics assembly. Trusted by manufacturers worldwide for over 85 years.