Indium CW-807 Wire Solder 52916-0113 | SAC305 Lead-Free No-Clean ROL0 | .010" Dia | 1/4lb Spool
Indium CW-807 Wire Solder 52916-0113 | SAC305 Lead-Free No-Clean ROL0 | .010" Dia | 1/4lb Spool
Indium CW-807 (part number 52916-0113) is Indium Corporation’s best-selling flux-cored wire solder in a SAC305 (Sn96.5/Ag3/Cu0.5) lead-free formulation, in an ultra-fine .010" diameter, 1/4lb spool. The .010" diameter is one of the finest standard wire diameters available — designed for precision hand soldering of ultra-fine-pitch SMD components, micro-pad rework, and applications where a larger diameter wire would deposit excess solder. CW-807 meets J-STD-004B ROL0, is halogen-free (<500ppm), and passes SIR and ECM testing. RoHS compliant.
Key Specifications
| Specification | Value |
|---|---|
| Part Number / SKU | 52916-0113 |
| Product Series | CW-807 |
| Alloy | SAC305 — Sn96.5/Ag3/Cu0.5 |
| Flux Type | No-Clean, ROL0 |
| Flux Content | 2% (nominal) |
| Halogen Content | <500ppm — halogen-free per J-STD-004B & JEITA ET-7304 |
| Wire Diameter | .010" |
| Spool Weight | 1/4 lb |
| Compliance | J-STD-004B ROL0; SIR & ECM tested; RoHS compliant |
| Melting Point | ~217°C (SAC305) |
| Brand | Indium Corporation |
Key Features
- Ultra-fine .010" diameter — one of the finest standard wire diameters; ideal for precision SMD rework, micro-pad soldering, and fine-pitch lead attachment where larger diameters deposit too much solder
- SAC305 lead-free — RoHS compliant — industry-standard lead-free alloy for all RoHS-compliant electronics manufacturing
- Halogen-free no-clean flux — ROL0 — <500ppm total halogen; no post-solder cleaning required
- SIR & ECM tested — residue is electronically safe for virtually all applications
- 1/4lb spool — ideal for low-volume, lab, and rework use — smaller spool for shops that don’t need full production quantities of fine-diameter wire
Frequently Asked Questions
When should I use .010" wire instead of .020" or .032"?
Use .010" wire when solder volume control is critical — primarily for ultra-fine-pitch SMD components (0402, 0201, fine-pitch QFP/SOP leads), micro-pad rework, and any joint where a larger diameter wire would deposit excess solder and risk bridging. For general through-hole and standard 0603+ SMD work, .020" or .032" is more practical and efficient. The .010" diameter requires more wire feed per joint but gives the technician maximum control over solder volume.
Is the no-clean residue from CW-807 .010" safe to leave on the board?
Yes — CW-807 passes J-STD-004B SIR and ECM tests regardless of wire diameter. The flux chemistry and residue behavior are the same across all CW-807 diameters.
What temperature should I use for hand soldering SAC305 with .010" wire?
SAC305 melts at ~217°C. Tip temperatures of 330–360°C are typical for fine-pitch SAC305 hand soldering. Lower tip mass (finer cartridge tips) and lower-power irons may require temperatures toward the higher end to maintain heat recovery. JBC’s instant heat-up system and precision C210/C115 cartridges are ideal for fine-pitch SAC305 work with .010" wire.
Is 52916-0113 compatible with SnPb solder paste in a mixed process?
CW-807 wire is compatible with all common solder alloys, but using SAC305 wire on assemblies printed with SnPb paste (or vice versa) creates mixed-alloy joints. For process consistency, match wire alloy to your paste alloy. Contact MTE Solutions for guidance on mixed-alloy rework situations.
Are larger spool sizes available for .010" CW-807 SAC305?
Contact MTE Solutions at 651-600-3838 for availability of .010" CW-807 SAC305 in 1lb spool configurations or other packaging options.
