MG Chemicals 8329TFF-25ML, Fast Cure Thermal Adhesive, 25ml Dual Syringe, Case of 6
MG Chemicals 8329TFF-25ML, Fast Cure Thermal Adhesive, 25ml Dual Syringe, Case of 6
The MG Chemicals 8329TFF-25ML is a 2-part, 1:1 fast-cure thermal adhesive that bonds heatsinks to CPUs, LEDs, and other heat-generating electronic components where both thermal conductivity and electrical insulation are required. It mixes to a smooth off-white paste, has a 5-minute working time and 15-minute set time, and cures to a hard, durable polymer with 0.8 W/(m·K) thermal conductivity. UL 94V-0 flame retardant registered (UL File# E334302). Sold as a case of 6 dual syringe kits.
Sold in cases of 6.
Specifications
| Parameter | Details |
|---|---|
| Part Number | 8329TFF-25ML |
| Brand | MG Chemicals |
| System | 2-part, 1:1 mix ratio |
| Volume | 25 mL (net) |
| Net Weight | 40.1 g |
| Packaging | Dual syringe kit |
| Pack Quantity | Case of 6 kits |
| Working Time | 5 minutes |
| Set Time | 15 minutes |
| Thermal Conductivity | 0.8 W/(m·K) |
| Electrical Properties | Electrically insulating |
| Flame Rating | UL 94V-0 (UL File# E334302) |
| Appearance | Smooth off-white paste |
| Substrate Compatibility | Metals, ceramics, glass, most plastics used in electronic assemblies |
| Chemical Resistance | Humidity, salt water, mild bases, aliphatic hydrocarbons |
| CTE | Low CTE prior to Tg |
Frequently Asked Questions
What is the difference between thermal adhesive and thermal grease?
Thermal grease (like MG Chemicals 8616) transfers heat but does not bond — it requires mechanical fasteners to hold the heatsink in place. Thermal adhesive like the 8329TFF permanently bonds the heatsink to the component while also conducting heat, eliminating the need for clips or screws. Use thermal adhesive when mechanical attachment is not possible or practical.
Is the 8329TFF electrically conductive?
No. The 8329TFF is thermally conductive but electrically insulating, making it safe to use directly on PCB pads, LED substrates, and other surfaces where electrical isolation between the component and heatsink is required.
How do I mix and apply the 8329TFF dual syringe?
Dispense equal amounts of Part A and Part B onto a clean mixing surface and blend thoroughly for at least 1 minute until the color is uniform. Apply to the bonding surface immediately — working time is 5 minutes. For the 50ml cartridge size, a static mixing tip and caulking gun or pressurized dispenser can be used for automated or high-volume applications.
What surfaces does the 8329TFF bond to?
The 8329TFF bonds well to metals, ceramics, glass, and most plastics used in electronic assemblies. Surface preparation (clean, dry, free of oils) improves bond strength. It is not recommended for flexible substrates where the cured epoxy's rigidity may cause delamination under thermal cycling.
