ASM 800075, UFP ECO Understencil Cleaning Roll, 443mm x 44m, Case of 15

The unique 3D architecture of DEK UFP ECO understencil cleaning rolls counters the risk of contamination as the fabric traps solder paste and solders balls within its pockets. This is a key differentiator from paper-based products that allow paste to remain on the surface of the paper, creating the potential for contamination. Consequently, DEK UFP ECO rolls not only ensure effective understencil cleaning, they also prevent contamination-related defects.

Ideal for ultra-fine-pitch apertures inherent with today’s miniaturized devices, DEK UFP ECO rolls ensure a quick and effective clean. The hydrophilic properties of the fibers provide fast wicking, as solvent is delivered through the fabric to the bottom of stencil instantaneously so that cleaning is more thorough and solvent consumption is reduced.

Features and benefits:

■ Outstanding cleaning performance

■ Reduced solvent consumption by an average of 50%

■ Unique 3D structure traps solder particles away from the stencil, removing smear ■ Ultra-low linting, Class 1000, ISO6 cleanroom compatible

■ Enhanced vacuum performance

■ Hydrophilic fiber structure for rapid solvent wicking

■ ESD-safe packaging

■ Improved process control

■ Non-abrasive structure of fabric increases stencil and coating life

■ Environmentally-friendly, chloride-free, recyclable

■ Faster, more effective cleaning cycle leading to higher throughput

Fabric width (mm): 443

Core width (mm): 457

Inner core diameter (mm): 19.5

Roll max outer diameter (mm): 100

Roll length (m): 44

Technical Data Sheet