Indium 8.9HF Solder Paste PASTEOT-800495-500G | SAC305 Lead-Free No-Clean Type 4 | 500g Jar
Indium 8.9HF Solder Paste — PASTEOT-800495-500G | SAC305 Lead-Free No-Clean Type 4 | 500g Jar
Indium 8.9HF (SKU: PASTEOT-800495-500G) is a halogen-free, no-clean lead-free solder paste formulated with SAC305 alloy (96.5Sn/3.0Ag/0.5Cu) and Type 4 powder at 88.5% metal load, packaged in a 500g jar. Engineered for RoHS-compliant SMT assembly, 8.9HF delivers exceptional print definition, extended tack time, and low voiding on BGA, QFN, and fine-pitch components. The 500g jar is suited for open-jar stencil printing with squeegee or spatula. Ships overnight only due to refrigeration requirements.
Specifications
| Part Number / SKU | PASTEOT-800495-500G |
|---|---|
| Product Line | 8.9HF |
| Alloy | SAC305 (96.5Sn/3.0Ag/0.5Cu) — Lead-Free |
| Melting Point | 217–220°C |
| Metal Load | 88.5% |
| Powder Type | Type 4 (20–38μm) |
| Flux Type | No-Clean, Halogen-Free (8.9HF) |
| Halogen Content | <900ppm Cl/Br (halogen-free per J-STD-004) |
| Reflow Atmosphere | Air |
| Container | 500g jar |
| Shelf Life | 6 months refrigerated (2–10°C) |
| Compliance | RoHS, REACH, J-STD-004, J-STD-005 |
| Brand | Indium Corporation |
| Shipping Requirement | Overnight only (temperature-sensitive) |
Key Features
- SAC305 lead-free alloy — 96.5Sn/3.0Ag/0.5Cu with 217–220°C melting range; RoHS and REACH compliant for all standard lead-free electronics manufacturing markets
- Type 4 fine powder (20–38μm) — precise paste deposition on fine-pitch components, 01005/0201/0402 passives, BGA, CSP, QFN, and LGA packages down to 0.4mm pitch
- Low voiding performance — optimized flux chemistry minimizes voiding on BGA and QFN pads for high-reliability assemblies
- Halogen-free no-clean flux — <900ppm Cl/Br; meets J-STD-004 halogen-free classification; no post-reflow cleaning required in most applications
- 500g jar format — suited for open-jar stencil printing with squeegee or spatula; flexible for varied and lower-volume production environments
- Extended tack time — maintains component placement stability during high-speed, high-mix SMT production
- Wide process window — forgiving reflow profile tolerance for robust production across varying thermal conditions
- ANSI/J-STD-004 & J-STD-005 compliant — meets all applicable IPC flux and solder paste specifications
Industries & Applications
- Electronics manufacturing — SMT assembly lines using lead-free SAC305 paste for consumer, industrial, and commercial PCB production
- Automotive electronics — RoHS-compliant solder paste for ADAS, powertrain, and body control module assemblies requiring low voiding on BGA and QFN
- Medical device manufacturing — high-reliability fine-pitch assembly with clean, low-residue no-clean flux where board contamination must be minimized
- Aerospace and defense electronics — fine-pitch and BGA assembly requiring J-STD-004 compliant, halogen-free flux chemistry
- Industrial control and power electronics — SAC305 lead-free paste for relay, sensor, and power module board assembly
- Contract electronics manufacturing (CEM/EMS) — high-mix SMT production requiring consistent print performance across a wide range of component types and pitches
Available Formats — Indium 8.9HF SAC305
| Part Number | Format | Size | Notes |
|---|---|---|---|
| PASTEOT-800495-500G | Jar | 500g | No MOQ — this listing |
| PASTEOT-800494-500G | Jar | 500g | MOQ 6 jars (production volume) |
| PASTEOT-800495-600G | Cartridge | 600g | For pneumatic dispensing / enclosed systems |
Frequently Asked Questions
What is the difference between PASTEOT-800495-500G and PASTEOT-800494-500G?
Both are Indium 8.9HF SAC305 no-clean solder paste in 500g jar format. PASTEOT-800495-500G is sold individually with no MOQ restriction, while PASTEOT-800494-500G has a MOQ of 6 jars. The alloy and flux chemistry are identical. Choose -800495 for lower-volume or single-unit ordering; -800494 for production-volume purchasing.
What does "8.9HF" mean?
8.9HF is Indium Corporation's flux designation: 8.9 is the flux series (no-clean, low-residue) and HF stands for Halogen-Free. The paste contains less than 900ppm of chlorine and bromine combined, meeting IPC J-STD-004 halogen-free requirements.
What applications is Indium 8.9HF best suited for?
8.9HF is optimized for fine-pitch SMT components (01005, 0201, 0402, 0603), BGA and CSP packages, QFN and LGA bottom-terminated components, and high-reliability assemblies in automotive, medical, industrial, and aerospace electronics. Type 4 powder supports stencil apertures down to 0.4mm pitch.
Does Indium 8.9HF require post-reflow cleaning?
No — 8.9HF is a no-clean formulation. Post-reflow residue is minimal, non-corrosive, and electrically safe. No cleaning is required in most applications. If your process requires a fully cleaned board, consult Indium's TDS for cleaning compatibility or consider Indium's water-wash paste lines.
What is the shelf life and storage requirement?
Indium 8.9HF has a 6-month shelf life when stored refrigerated at 2–10°C (35–50°F). Allow the jar to reach room temperature (approximately 4 hours) before opening and use. Do not use paste that has exceeded its shelf life or shows visible separation.
Why does solder paste require overnight shipping?
Solder paste is temperature-sensitive and must be shipped and stored refrigerated to preserve flux activity, viscosity, and shelf life. Refrigerate immediately upon receipt and allow to reach room temperature before use.
