ASM 431800 - NanoClear Stencil Coating Fluxophobic Wipes 10/Box
ASM 431800 NanoClear® Stencil Coating Fluxophobic Wipes, 10 Wipes/Box
ASM NanoClear® is a wipe-on fluxophobic stencil coating that reduces cleaning frequency and improves solder paste release for fine-pitch SMT printing. Each pre-saturated wipe coats one stencil up to 29" x 29" — compatible with stainless steel and nickel stencils. Sold as 10 individually pouched wipes per box. REACH compliant.
Product Specifications
| Specification | Value |
|---|---|
| Part Number | 431800 |
| Manufacturer | ASM Assembly Systems |
| Product | NanoClear® Stencil Coating |
| Form | Pre-saturated wipes (individually pouched) |
| Wipes per Box | 10 wipes |
| Coverage per Wipe | Up to 29" x 29" (737mm x 737mm) |
| Compatible Stencils | Stainless steel, nickel |
| Bond Type | Permanent (reapplies only to uncovered areas) |
| Chemical State When Dry | Chemically inert — no interaction with solder paste or flux |
| Compliance | REACH compliant |
Key Features & Benefits
- Reduces Cleaning Frequency — Fluxophobic surface prevents paste buildup on stencil underside, allowing more prints between cleanings
- Improves Paste Release — Better aperture fill and print quality, especially for fine-pitch and small aperture applications
- Permanent Bond — Forms a durable coating; when reapplied, only adheres to uncovered areas
- Chemically Inert When Dry — No contamination or interference with solder paste, flux, or cleaning solvents
- Easy Wipe-On Application — No special equipment required; works on new or existing stencils
- Cost-Effective — Less expensive than alternative wipe-on coatings; reduces USC fabric, solvent, and labor costs
- REACH Compliant — Meets EU environmental and safety standards
Application Process
- Clean Stencil — Ensure stencil is clean and dry before application
- Apply Coating — Wipe NanoClear® onto stencil surface using the provided pre-saturated wipe
- Allow to Dry — Let coating cure until chemically inert
- Start Printing — Stencil is ready for production
Typical Applications
- Fine-pitch SMT assembly (0201, 01005 components)
- Micro-BGA and CSP solder paste printing
- High-density PCB assembly
- Lead-free and no-clean paste printing
- High-volume production lines requiring minimal cleaning downtime
- Stencil rejuvenation for existing stencils with paste release issues
Frequently Asked Questions
How many stencils does one box of NanoClear wipes coat?
Each box contains 10 individually pouched wipes. One wipe coats one stencil up to 29" x 29" (737mm x 737mm), covering most standard SMT stencil sizes. One box = 10 stencil applications.
Is NanoClear compatible with all stencil types?
It is compatible with stainless steel (laser-cut and electroformed) and nickel stencils. It can also be reapplied to previously nano-coated stencils.
Will NanoClear contaminate my solder paste?
No — once cured, NanoClear is chemically inert and will not interact with solder paste, flux, or cleaning solvents used in the printing process.
How does NanoClear reduce cleaning costs?
By preventing paste buildup on the stencil underside, NanoClear reduces the frequency of understencil cleaning (USC) cycles — using less USC fabric, solvent, and operator time per production run.
Can NanoClear be reapplied to an existing stencil?
Yes — it forms a permanent bond but only adheres to uncovered areas when reapplied, making it easy to maintain coating coverage over the life of the stencil without buildup.
