MG Chemicals 8329TCM-6ML Thermal Adhesive High TC, 6ml Syringe Kit, Case of 5
MG Chemicals 8329TCM-6ML Thermal Adhesive High TC — 6ml Syringe Kit, Case of 5
MG Chemicals 8329TCM-6ML is a 2-part, 1:1 epoxy thermal adhesive formulated for high thermal conductivity (1.4 W/m·K) in electronics assembly applications. It cures to a hard, durable, electrically insulating polymer that bonds metals, ceramics, glass, and most plastics used in electronic assemblies. With a 45-minute working time and cure at room temperature or accelerated at 65°C, it provides flexibility for both benchtop assembly and production environments. Most commonly used to attach heat sinks to CPUs, LEDs, and other heat-generating components where both a strong mechanical bond and thermal path are required.
Key Specifications
- Part Number: 8329TCM-6ML
- Type: 2-part thermally conductive epoxy adhesive
- Thermal Conductivity: 1.4 W/(m·K)
- Mix Ratio: 1:1 by volume
- Net Volume: 6 mL (14.8 g) per syringe kit
- Packaging: 2-syringe kit; Case of 5 kits
- Working Time: 45 minutes
- Cure Time: 24 hours at room temperature, or 1 hour at 65°C (149°F)
- Electrical: Strong electrical insulation
- Color: Dark grey
- Viscosity: High viscosity — hand mix required prior to application
- Chemical Resistance: Humidity, salt water, mild bases, aliphatic hydrocarbons
Applications
- Heat sink attachment to CPUs, GPUs, and power transistors
- LED thermal management and heat sink bonding
- Thermally conductive, electrically insulating bonds in PCB assemblies
- Bonding metals, ceramics, glass, and plastics in electronic enclosures
- Any application requiring a permanent conductive thermal path with mechanical strength
Frequently Asked Questions
How is the 8329TCM-6ML mixed and applied?
Dispense equal volumes of Part A and Part B (1:1 ratio) onto a clean mixing surface and blend thoroughly by hand for at least 2 minutes before applying. Due to its high viscosity, mixing tips are not suitable — hand mixing is required. Apply to the substrate within the 45-minute working time and press components together firmly.
Is the 8329TCM-6ML electrically conductive?
No — despite its high thermal conductivity, 8329TCM provides strong electrical insulation. It is safe to use directly on component surfaces and PCB pads without risk of short circuits.
What is the difference between 8329TCM and 8349TFM?
8329TCM is a high-viscosity compound formulated for maximum thermal conductivity, requiring hand mixing. 8349TFM is a lower-viscosity alternative compatible with mixing tips for easier dispensing in production environments. Both are thermally conductive, electrically insulating epoxies.
Can cure time be accelerated?
Yes — the 8329TCM cures in 24 hours at room temperature, or in approximately 1 hour when heated to 65°C (149°F). Elevated temperature cure is recommended for production workflows requiring faster throughput.
What surfaces does 8329TCM bond to?
It bonds well to metals, ceramics, glass, and most plastics commonly used in electronic assemblies including aluminum heat sinks, copper substrates, FR4 PCBs, and engineering plastics.
