Adhesive - Thermal Conductive Epoxy, Medium Cure (Ratio 1:1) 121 G (4.26 Oz)

Adhesive - Thermal Conductive Epoxy, Medium Cure (Ratio 1:1) 121 G (4.26 Oz)

Adhesive - Thermal Conductive Epoxy, Medium Cure (Ratio 1:1) 121 G (4.26 Oz)

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8329TCM - MEDIUM CURE THERMALLY CONDUCTIVE ADHESIVE 8329TCM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. 8329TCM has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFM. For a faster working life, use 8329TCF. For a longer working life, use 8329TCS. Features and Benefits Thermal conductivity of 1.4 W/(m·K) 1:1 mix ratio Working life: 45 minutes Cure time: 24 hours room temperature or 1 hour at 65 °C (149 °F) Provides strong electrical insulation High tensile and compressive strength Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons Shelf life: ≥3 years RoHS 3 compliant Catalog Number Size Packaging 8329TCM-6ML 14.8 g (0.52 oz) Dual syringe 8329TCM-50ML 121 g (4.26 oz) 2 Jar kit 8329TCM-200ML 494 g (1.09 lb) 2 Can kit

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