MG Chemicals 8331S-15G, Silver Conductive Epoxy Adhesive, 14g Syringe Kit, Case of 1 Kit

MG Chemicals 8331S-15G Silver Conductive Epoxy Adhesive, Slow Cure, 14g Syringe Kit

MG Chemicals 8331S is a 2-part, heat-cured silver conductive epoxy adhesive with a long 4-hour working time and NASA low outgassing approval. Smooth, non-sagging, and thixotropic, it bonds well to a wide variety of substrates. Ideal as a solder replacement for heat-sensitive electronic components or for making conductive connections where soldering is not an option — including bonding to glass, soft metals, and plastics. Provides excellent EMI/RFI shielding and is very effective for filling seams between metal plates.

Key Specifications

Key Features

• NASA low outgassing approved — suitable for aerospace, vacuum, and space-grade applications
• High electrical conductivity — silver-filled formula for strong, permanent electrical connections
• 4-hour working time — long open time for complex assemblies requiring extended positioning
• 1:1 mix ratio — convenient equal-part mixing from 2-syringe kit
• Heat cure — 2 hours at 65°C or 30 minutes at 100°C for controlled cure scheduling
• Solder replacement — ideal for heat-sensitive components or substrates where soldering is not possible
• Excellent EMI/RFI shielding — effective for seam filling between metal plates and shielding enclosures
• Broad substrate adhesion — bonds to glass, soft metals, plastics, and many other substrates
• Chemical resistance — strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
• Room temperature storage — no refrigeration required

Ideal Applications

• Aerospace and space-grade assemblies requiring NASA low outgassing compliance
• Complex assemblies requiring extended working time for precise positioning
• Cold-soldering repairs on PCBs and electronic assemblies
• Conductive bonding to glass, soft metals, and plastics
• EMI/RFI shielding — seam filling between metal enclosure plates

Frequently Asked Questions

What is the difference between 8331S and 8331D?
8331S is the slow-cure, heat-cure version with a 4-hour working time and NASA low outgassing approval — ideal for complex assemblies and aerospace applications. 8331D is the faster version that cures at room temperature in 6 hours or in 10 minutes at 65°C, with a shorter 20-minute working time. Both use a 1:1 mix ratio and silver-filled formula.

Does 8331S cure at room temperature?
No — 8331S requires heat to cure. It cures in 2 hours at 65°C (149°F) or in 30 minutes at 100°C (212°F). This heat-cure requirement gives it a long 4-hour working time at room temperature.

What does NASA low outgassing approval mean?
NASA low outgassing approval means the cured material meets NASA's ASTM E595 standard for total mass loss and collected volatile condensable materials — a requirement for materials used in spacecraft, satellites, and vacuum environments where outgassing can contaminate sensitive optics or electronics.

Can 8331S replace solder?
Yes — 8331S is designed as a solder replacement for heat-sensitive components or substrates where soldering is not possible, including glass, soft metals, and plastics.

Technical Data Sheet (TDS)  |  Safety Data Sheet (SDS)