ASM 431800 - NanoClear Stencil Coating Fluxophobic Wipes 10/Box

ASM 431800 - NanoClear® Stencil Coating Fluxophobic Wipes 10/Box

Self-applied fluxophobic stencil coating technology for improved SMT printing performance. ASM NanoClear® is a cost-effective wipe-on stencil coating that delivers high-performance results by reducing cleaning frequency and improving paste release. Designed to overcome the challenges of smaller aperture sizes in fine-pitch SMT assembly, NanoClear® offers a unique solution to increase efficiency and reduce costs in solder paste printing operations.

PRODUCT SPECIFICATIONS
• SKU: 431800
• Product: NanoClear® Stencil Coating
• Form: Pre-saturated wipes
• Wipes per Box: 10 wipes (1 pouch per wipe)
• Coverage: One pouch coats one stencil up to 29in x 29in
• Compatible Stencils: Stainless steel or nickel
• Compliance: REACH compliant
• Manufacturer: ASM Assembly Systems

KEY FEATURES & BENEFITS
✓ Reduces Cleaning Frequency - Fewer stencil wipes = more production time
✓ Improves Paste Release - Better aperture fill and print quality
✓ Cost-Effective - Less expensive than alternative wipe-on coatings
✓ Easy Application - Simple wipe-on process for new or existing stencils
✓ Permanent Bond - Forms durable coating that lasts
✓ Reapplicable - Only adheres to uncovered areas when reapplied
✓ Chemically Inert - No interaction with solder paste when dry
✓ REACH Compliant - Environmentally responsible chemistry

IDEAL APPLICATIONS
• Fine-pitch SMT assembly (0201, 01005 components)
• Micro-BGA and CSP printing
• High-density PCB assembly
• Lead-free solder paste printing
• No-clean paste applications
• High-volume production lines
• Stencils with small apertures
• Applications requiring minimal cleaning

INCREASES EFFICIENCY
Reduces Cleaning Frequency: NanoClear® coating prevents solder paste buildup on the stencil underside, allowing more prints between cleanings
More Production Time: Fewer cleaning cycles means more time for actual production or SPI (Solder Paste Inspection)
Higher Throughput: Reduced downtime translates to increased board output

REDUCES COSTS
• Less Cleaning: Uses less understencil cleaning (USC) fabric and solvent
• Lower Material Costs: Less expensive than alternative wipe-on coatings
• Reduced Waste: Fewer cleaning cycles = less consumable waste
• Labor Savings: Less time spent on stencil cleaning and maintenance

FLUXOPHOBIC COATING TECHNOLOGY
NanoClear® creates a fluxophobic (flux-repelling) surface on the stencil that:
• Prevents solder paste from adhering to the stencil underside
• Improves paste release from apertures
• Reduces paste residue buildup
• Maintains consistent print quality over extended runs
• Enables cleaner, more defined deposits

FINE-PITCH & SMALL APERTURE PERFORMANCE
As component sizes shrink and apertures get smaller, paste release becomes more challenging. NanoClear® coating addresses this by:
• Improving paste release from tight apertures
• Reducing bridging and insufficient paste deposits
• Enabling consistent printing of 0201, 01005, and micro-BGA components
• Maintaining print quality with lead-free and no-clean pastes

EASY APPLICATION PROCESS
1. Clean Stencil: Ensure stencil is clean and dry
2. Apply Coating: Wipe NanoClear® onto stencil surface using provided wipe
3. Allow to Dry: Let coating cure (chemically inert when dry)
4. Start Printing: Stencil is ready for production

New or Existing Stencils: NanoClear® can be applied to new stencils or used to rejuvenate existing stencils with performance issues.

PERMANENT BOND & REAPPLICATION
NanoClear® forms a permanent bond with the stencil surface. When reapplied, it only adheres to uncovered areas, making it easy to maintain coating coverage over the life of the stencil.

CHEMICALLY INERT WHEN DRY
Once cured, NanoClear® is chemically inert and will not interact with solder paste, flux, or cleaning solvents. This ensures no contamination or interference with the printing process.

COMPATIBLE STENCIL MATERIALS
• Stainless steel stencils (laser-cut, electroformed)
• Nickel stencils
• Nano-coated stencils (can be recoated)

COVERAGE & PACKAGING
Each box contains 10 individually pouched wipes. One pouch will coat one stencil measuring up to 29in x 29in (737mm x 737mm), covering most standard SMT stencil sizes.

REACH COMPLIANCE
NanoClear® is REACH (Registration, Evaluation, Authorization and Restriction of Chemicals) compliant, meeting European Union environmental and safety standards.

TECHNICAL SPECIFICATIONS TABLE

Download Technical Data Sheet (PDF)

ASM Assembly Systems - Leading manufacturer of SMT assembly equipment, stencil printing solutions, and process materials for electronics manufacturing worldwide.