MG Chemicals 4900P-25G, Lead-Free Solder Paste, SAC305, No-Clean
MG Chemicals 4900P-25G, Lead-Free Solder Paste, SAC305, No-Clean
MG Chemicals 4900P-25G is a lead-free SAC305 no-clean solder paste supplied in a 25g syringe. The manufacturer lists a net volume of 3.38 mL for this package. Its halogen-free formulation supports fine-pitch printing, wetting on copper OSP finishes, and reflow in air or nitrogen. Confirm that the syringe delivery hardware and printing method suit your process.
Best Uses / Applications
For prototype and low-volume PCB assembly, controlled paste application, and evaluation of SAC305 stencil-printing processes. Electronics manufacturers working with copper OSP finishes can evaluate its wetting behavior on representative boards. Fine-feature capability must be validated with the actual stencil, deposit geometry, components, and reflow profile.
Key Features
- No-clean SAC305 formulation using tin, silver, and copper powder.
- Manufacturer-described repeatable printing, long stencil and tack life, and medium-soft, non-cracking residue.
- Suitable for air or nitrogen reflow.
- 25g syringe format for smaller material requirements.
Technical Specifications
| Part number | 4900P-25G |
|---|---|
| Manufacturer | MG Chemicals |
| Alloy | SAC305: Sn96.5/Ag3/Cu0.5 |
| Flux | No-clean, rosin; ROL0 under J-STD-004B |
| Metal loading | 88% by weight, manufacturer TDS |
| Net weight | 25g |
| Net volume | 3.38 mL |
| Packaging | Syringe |
| Printing capability | Manufacturer describes printing with stencils as small as 0.3 mm; actual results depend on process conditions |
| Alloy / flux references | Manufacturer states alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements; flux meets J-STD-004B |
| Storage | 2–10°C, upright with tip down |
| Unopened shelf life | TDS dated October 2, 2025, version 4.0: 3.5 years at 2–10°C; 1 year at 20–25°C. Check applicable lot expiry and documentation |
Storage and Process Guidance
Store in the manufacturer's recommended orientation to limit flux separation and air entrapment. Follow the applicable handling instructions for warming sealed material before opening; do not use an assumed universal warm-up period. Validate reflow on the actual assembly rather than treating a general profile as an oven recipe. No-clean residue may remain only when accepted by the qualified application; qualify removal if cleaning is required.
Package and Formulation Comparison
| Option | Selection consideration |
|---|---|
| 4900P-25G | This listing: SAC305 no-clean paste, 25g syringe, 3.38 mL. |
| Larger jars | Do not assume availability: the manufacturer's current product page marks 4900P-250G discontinued. |
| Other solder paste formulations | Compare alloy, powder, flux chemistry, residue management, and storage conditions; package size alone is not a substitution criterion. |
Frequently Asked Questions
Is 25g the same as 0.88 mL?
No. Grams measure mass and milliliters measure volume. MG Chemicals lists this 25g package as 3.38 mL.
Does this paste require cleaning?
It is a no-clean formulation. Determine whether residue can remain from your assembly, inspection, electrical testing, and customer requirements.
Can it print through 0.3 mm features?
The manufacturer describes printing with stencils as small as 0.3 mm. Validate the actual stencil geometry and process; this is not a universal minimum component pitch.
How should it be stored?
The TDS recommends 2–10°C, upright with the tip down. Check the lot expiry and applicable handling instructions before use.
Can it be reflowed in nitrogen?
Yes. The manufacturer lists air or nitrogen atmospheres. Validate the profile for the board and components.
Is the 250g jar another current ordering option?
The manufacturer's product page marks 4900P-250G discontinued. This listing is for 4900P-25G; confirm alternatives before ordering.
Related Resources
Solder Paste collection | Soldering, Desoldering & Rework guide
Technical reference: MG Chemicals 4900P Technical Data Sheet, October 2, 2025, version 4.0. Use the applicable current material and safety documentation for production.
