Chip Quik SMD291SNL250T3, Solder Paste in Jar, 250g (T3) SAC305, No Clean

Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal.

Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 88.5% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 217-220C (423-428F)
Size: 250g jar

Shelf Life
Refrigerated >6 months, unrefrigerated >2 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Technical Data Sheet

Safety Data Sheet