Chip Quik SMD291SNL250T3, Solder Paste in Jar, 250g (T3) SAC305, No Clean
Chip Quik SMD291SNL250T3, Solder Paste in Jar, 250g (T3) SAC305, No Clean
Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal.
Specifications
Alloy: Sn96.5/Ag3.0/Cu0.5
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Content: 88.5% metal by weight.
Particle Size: T3 (25-45 microns)
Melting Point: 217-220C (423-428F)
Size: 250g jar
Shelf Life
Refrigerated >6 months, unrefrigerated >2 months
Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
