Indium NC-SMQ92J Solder Paste 63/37 Tin-Lead 500g - No-Clean Type 3 (MOQ: 6)
Indium NC-SMQ92J Solder Paste 63/37 Tin-Lead 500g - No-Clean Type 3 (MOQ: 6)
Indium NC-SMQ92J is a halogen-free, no-clean solder paste for surface-mount assembly, formulated to leave a benign, probe-testable residue that can be penetrated without clogging multi-point probes. This listing is for Sn63/Pb37 tin-lead alloy, Type 3 powder, in a 500g jar. The listed product reference is PASTEOT-82320-500G, with a minimum order of six jars.
Best Uses / Applications
Consider NC-SMQ92J for stencil-printed SMT assemblies using a qualified tin-lead process, including high-speed lines with rapid component placement and assemblies requiring electrical probe testing after reflow. Indium highlights fine-pitch deposition, wetting in air, extended open time and tack stability. Qualify the actual stencil, aperture geometry, components and thermal profile rather than assuming suitability from component size alone.
Key Features
- Halogen-free, no-clean flux system.
- Probe-testable residue designed not to clog multi-point probes.
- Excellent wetting during air reflow, as described by Indium.
- Consistent fine-pitch printing and extended open time.
- Strong initial tack and long-term tack stability.
- High humidity resistance, as described in the manufacturer datasheet.
Technical Specifications
| Specification | Detail |
|---|---|
| Manufacturer / formulation | Indium Corporation / NC-SMQ92J |
| Listed product reference | PASTEOT-82320-500G |
| Alloy | Sn63/Pb37, 63% tin / 37% lead |
| Powder type for this listing | Type 3 |
| Flux system | No-clean, halogen-free |
| Flux classification | ROL0, manufacturer datasheet |
| Package | 500g jar |
| Minimum order | Six jars |
| Unopened shelf life / storage | Six months below 10°C, per manufacturer datasheet |
| Preparation before use | Allow paste to reach ambient working temperature; generally remove from refrigeration at least two hours before use and verify temperature |
| Reference stencil life | More than 12 hours at 30–60% RH and 22–28°C |
| Reference print speed | 25–100 mm/second |
| Reference reflow atmosphere | Air or nitrogen |
The reviewed manufacturer datasheet, Form 97703 R13, covers both Type 3 and Type 4 formulations. The vendor web-store page describes a Type 4 version; that does not change the Type 3 configuration offered in this listing. Metal loading depends on powder type and printing versus dispensing formulation, so no single family-wide metal percentage is assigned here.
Process Comparison: Type 3 vs. Type 4 NC-SMQ92J
| Selection factor | Type 3, this listing | Type 4 option in the product family |
|---|---|---|
| Product identity | NC-SMQ92J with Type 3 powder. | NC-SMQ92J with a different powder classification. |
| Formulation details | Use Type 3-specific metal-loading and process data. | Do not transfer Type 3 metal loading to Type 4. |
| Selection approach | Qualify powder type against stencil openings, print release and the assembly process. Do not substitute solely because the flux family name matches. | |
Storage, Preparation and Reflow Guidance
Store unopened paste below 10°C and observe the manufacturer's six-month shelf life. Allow the container to reach ambient working temperature before use; Indium generally recommends at least two hours out of refrigeration, with actual equilibration time depending on container size. Label opened containers with the opening date and time.
For Sn63 and Sn62 alloys, the reviewed datasheet recommends a 210–230°C peak and 45–60 seconds above liquidus as starting guidance, not a universal production recipe. Measure the assembly profile with thermocouples and qualify it for board size, thickness, component density and process requirements.
NC-SMQ92J is designed for no-clean use. If residue removal is required, Indium identifies commercially available flux-residue removers; qualify the cleaner and process for the assembly. Follow the applicable safety data sheet and facility handling procedures for lead-containing solder paste.
Frequently Asked Questions
Is this Type 3 or Type 4 solder paste?
This MTE listing is Type 3. The reviewed manufacturer datasheet covers both types, while the vendor web-store description refers to a Type 4 version.
What alloy and package does this listing supply?
Sn63/Pb37 tin-lead solder paste in a 500g jar, with a listed minimum order of six jars.
Does no-clean mean residue-free?
No. Indium describes a benign, probe-testable residue. Decide whether cleaning is required under your assembly and end-use requirements.
How should unopened paste be stored?
The reviewed datasheet specifies six months below 10°C. Follow the container labeling and manufacturer handling instructions for the supplied lot.
Can it be used immediately after refrigeration?
Allow it to reach ambient working temperature first. Indium generally recommends removing it at least two hours before use, with actual time depending on container size, and verifying paste temperature.
Can I use one reflow recipe for every assembly?
No. Manufacturer profiles are starting guidance. Measure and qualify the actual assembly profile rather than applying a family-wide recipe without validation.
Related Reading
Solder Paste Printing Defects: How to Identify and Fix the 7 Most Common Issues
