Parker Chomerics 65-02-GEL30-0600 Therm-A-Gap Gel 30 Thermal Interface Gel 600cc EFD

Parker Chomerics 65-02-GEL30-0600 Therm-A-Gap™ Gel 30 | 3.5 W/m‑K | 600cc EFD Cartridge

Parker Chomerics Therm-A-Gap™ Gel 30 is a single-component, fully cured, dispensable thermal interface gel delivering 3.5 W/m‑K thermal conductivity. Supplied ready to use with no mixing or curing required, Gel 30 eliminates time-consuming hand assembly and integrates directly into high-volume automated dispense processes. Its ultra-low compression force reduces mechanical stress on sensitive components, while high surface tack and reworkability provide assembly flexibility. Proven reliable in extreme temperature cycling, shock, and vibration environments. Meets Telcordia (Bellcore) silicone specifications for telecom applications.

Part Number: 65-02-GEL30-0600 | Volume: 600cc EFD Cartridge | Sold individually.

Specifications

Key Features

• Fully cured — no pump out — supplied ready to dispense with no mixing or curing required; significantly reduces assembly time and manufacturing complexity compared to two-part systems
• 3.5 W/m‑K thermal conductivity — high bulk thermal conductivity with low thermal impedance at both thin and thick bond line gaps; effective across a wide range of gap thicknesses
• Ultra low compression force — deflects easily under very low compressive forces, reducing mechanical stress on sensitive components and decreasing component failure rates
• High tack and reworkable — adheres well to mating surfaces while remaining reworkable for design changes and repair operations
• Variable bond line accommodation — fills a variety of gap thicknesses for consistent thermal performance across multiple device types in a single product
• Automated dispense compatible — 600cc EFD cartridge format integrates directly into high-volume automated dispensing lines
• Proven long-term reliability — tested and validated in extreme temperature cycling, shock, and vibration environments
• Telcordia (Bellcore) compliant — meets silicone specifications for telecommunications and networking hardware applications

Typical Applications

• Automotive Electronic Control Units (ECUs) and power electronics
• Power supplies, voltage regulators, and power semiconductors
• Memory modules, DIMMs, and power modules
• Microprocessors, CPUs, and graphics processors (GPUs)
• Flat panel displays and consumer electronics
• Telecommunications and networking hardware (Telcordia-compliant applications)
• Industrial electronics requiring high-volume automated assembly

Frequently Asked Questions

Does Therm-A-Gap Gel 30 require mixing or curing?

No — Gel 30 is a single-component, fully cured gel supplied ready to dispense. No mixing, curing, or special preparation is required, which significantly reduces assembly time and complexity compared to two-part epoxy or silicone systems.

What is the thermal conductivity of Therm-A-Gap Gel 30?

Therm-A-Gap Gel 30 has a bulk thermal conductivity of 3.5 W/m‑K, providing high thermal performance and low thermal impedance across both thin and thick bond line gaps. This makes it suitable for applications where gap thickness varies across a PCB or assembly.

Is Gel 30 compatible with automated dispensing equipment?

Yes — Gel 30 is packaged in a 600cc EFD cartridge format specifically designed for use with standard EFD automated dispensing equipment. It is compatible with high-volume automated dispense processes and eliminates the manual assembly steps required by sheet or pad-type thermal interface materials.

Can Gel 30 be reworked after application?

Yes — Gel 30 has a high tack surface and is fully reworkable, providing flexibility for design changes, assembly corrections, and field repair operations without damaging components or substrates.

What is the difference between Therm-A-Gap Gel 30 and a thermal pad or phase change material?

Therm-A-Gap Gel 30 is a dispensable gel, meaning it is applied via automated or manual syringe dispensing and conforms to irregular surfaces and variable gap thicknesses without cutting or die-punching. Unlike rigid thermal pads, Gel 30 requires virtually no compression force, making it ideal for delicate or sensitive components. Phase change materials require heat to activate; Gel 30 is active at room temperature and requires no thermal cycling to perform.

What is the part number and package size for this listing?

This listing is for Parker Chomerics part number 65-02-GEL30-0600, which is the 600cc EFD cartridge format of Therm-A-Gap Gel 30. Contact MTE Solutions for availability of other package sizes.