Hakko A1265B, QFP Nozzle for FR-801, FR-802, FR-803; 32.2 x 32.2mm
Hakko A1265B — QFP Nozzle, 32.2 × 32.2mm, for FR-801 / FR-802 / FR-803
The Hakko A1265B is a QFP (Quad Flat Package) hot air nozzle measuring 32.2 × 32.2mm, designed for use with Hakko FR-801, FR-802, and FR-803 hot air rework and desoldering stations. It channels hot air uniformly around the perimeter of large QFP ICs to simultaneously reflow all leads for clean, damage-free component removal and placement.
Key Specifications
| Attribute | Detail |
|---|---|
| Part Number | A1265B |
| Brand | Hakko |
| Nozzle Type | QFP (Quad Flat Package) |
| Nozzle Size | 32.2 × 32.2mm |
| Compatible Stations | Hakko FR-801, FR-802, FR-803 |
| Application | Large QFP IC removal and placement via hot air reflow |
What is a QFP Nozzle?
QFP nozzles direct hot air from a rework station around all four sides of a quad flat package IC simultaneously. Unlike a general round or oval nozzle, QFP nozzles are square or rectangular and sized to match the component footprint — ensuring uniform heat distribution across every lead without overheating adjacent components. The A1265B at 32.2 × 32.2mm is suited for larger QFP packages commonly found in microcontrollers, DSPs, FPGAs, and communication ICs.
Compatible Hakko Rework Stations
| Station | Type |
|---|---|
| FR-801 | Hot air desoldering / rework station |
| FR-802 | Hot air desoldering / rework station |
| FR-803 | Hot air desoldering / rework station |
Important: Always verify nozzle compatibility with your specific station model and firmware version before ordering. Nozzle fitment varies by station series.
SMT Rework Best Practices for QFP Removal
- Apply fresh flux to all leads before heating to promote even solder reflow
- Preheat the board from below if possible to reduce thermal shock and warping
- Use the correct nozzle size — too small misses outer leads; too large risks heating adjacent components
- Allow the component to release naturally when all solder has reflowed; do not force lift
- Clean pads thoroughly with solder wick before replacing the component
Industries & Applications
- PCB rework and repair in electronics manufacturing
- Warranty repair and field service depots
- Contract electronics manufacturing (CEM/EMS)
- R&D and prototype board rework
- Military, aerospace, and medical electronics repair
Frequently Asked Questions
What size QFP packages does the A1265B handle?
The A1265B nozzle opening is 32.2 × 32.2mm. It is designed for QFP packages whose lead span (tip to tip across the body) fits within this nozzle aperture. Measure your component's lead span before selecting a nozzle size.
Is the A1265B compatible with the Hakko FR-810?
No — the A1265B is specified for FR-801, FR-802, and FR-803 stations. The FR-810 uses a different nozzle attachment system. Always verify compatibility with your station model.
Can I use a QFP nozzle for BGA or other package types?
QFP nozzles are optimized for packages with perimeter leads. For BGA (Ball Grid Array) packages, use a dedicated BGA nozzle sized to match the component body. Using a QFP nozzle on a BGA can result in uneven heating and poor reflow.
How do I clean hot air nozzles?
Allow the nozzle to cool before handling. Remove flux residue with IPA and a soft brush or cotton swab. Do not insert tools into the nozzle aperture — the air channel geometry is precision-formed and easily damaged.
How do I select the right nozzle size for my QFP?
Measure the outer lead-tip-to-lead-tip dimension on both axes of your QFP component. Select a nozzle whose inner aperture is slightly larger than this dimension so hot air clears all leads without obstruction. For the A1265B, target QFPs with a lead span up to approximately 30–31mm per side.
