MG Chemicals 860-3.78L, Silicone Heat Transfer Compound, 3.78L Pail, Case of 5

MG Chemicals 860-3.78L, Silicone Heat Transfer Compound, 3.78L Pail, Case of 5

860 is a CPU heat sink compound. Our thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPUapplications.

This silicone-based PC thermal paste is mostly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

• Thermal conductivity of 0.7 W/(m·K)
• High dielectric strength
• Broad service temperature range of -40 to 200 °C (-40 to 392 °F)
• Excellent corrosion resistance
• Non-bleeding heat transfer paste
• Non-electrically conductive
• Long service life

Technical Data Sheet

Safety Data Sheet