Indium 8.9HF Solder Paste PASTEOT-800494-500G | SAC305 Lead-Free No-Clean Type 4 | 500g Jar | MOQ: 6

Indium 8.9HF Solder Paste — PASTEOT-800494-500G | SAC305 Lead-Free No-Clean Type 4 | 500g Jar | MOQ: 6

Indium 8.9HF (SKU: PASTEOT-800494-500G) is a halogen-free, no-clean lead-free solder paste formulated with SAC305 alloy (96.5Sn/3.0Ag/0.5Cu) and Type 4 powder at 89% metal load, packaged in a 500g jar. Engineered for RoHS-compliant SMT assembly, 8.9HF delivers exceptional print definition, extended tack time, and low voiding on BGA, QFN, and fine-pitch components. The 500g jar format is suited for open-jar stencil printing processes. Minimum order quantity: 6 jars. Ships overnight only due to refrigeration requirements.

Specifications

Key Features

• SAC305 lead-free alloy — 96.5Sn/3.0Ag/0.5Cu; RoHS and REACH compliant for all standard lead-free electronics manufacturing markets
• Type 4 fine powder (20–38μm) — precise paste deposition on fine-pitch components, 0201/0402 passives, BGA, CSP, and QFN packages down to 0.4mm pitch
• Low voiding performance — optimized flux chemistry reduces voiding on BGA and QFN pads for high-reliability assemblies
• Halogen-free no-clean flux — <900ppm Cl/Br; meets J-STD-004 halogen-free classification; no post-reflow cleaning required in most applications
• 500g jar format — suited for open-jar stencil printing with squeegee or spatula; flexible for varied production environments
• Extended tack time — maintains component placement stability on high-speed, high-mix SMT production lines
• Excellent print definition — consistent stencil release and aperture filling for high-yield fine-pitch SMT printing
• ANSI/J-STD-004 & J-STD-005 compliant — meets all applicable IPC flux and solder paste specifications

Frequently Asked Questions

Why does this product have a minimum order quantity of 6?

The MOQ of 6 jars (3kg total) aligns with typical production consumption rates and ensures fresh product from the manufacturing lot. Solder paste has a 6-month refrigerated shelf life. For single-unit ordering, consider the 600g cartridge (PASTEOT-800495-600G), which is sold individually. Contact MTE Solutions at 651-600-3838 to discuss your requirements.

What is the difference between the 500g jar and the 600g cartridge?

The 500g jar (PASTEOT-800494-500G) is used with a squeegee or spatula in open-jar stencil printing setups. The 600g Semco cartridge (PASTEOT-800495-600G) is designed for pneumatic or automated cartridge-style paste dispensers. Both use the same 8.9HF flux chemistry and SAC305 alloy. Choose based on your printing equipment and process setup.

What does "8.9HF" mean?

8.9HF is Indium Corporation's flux designation: 8.9 is the flux series (no-clean, low-residue) and HF stands for Halogen-Free. The paste contains less than 900ppm of chlorine and bromine combined, meeting IPC J-STD-004 halogen-free requirements.

Does Indium 8.9HF require post-reflow cleaning?

No — 8.9HF is a no-clean formulation. Post-reflow residue is minimal, non-corrosive, and electrically safe. No cleaning step is required for most applications. If your process requires a cleaned board, consult Indium's TDS for cleaning compatibility or consider Indium's water-wash paste lines (6.6HF).

What fine-pitch components is this paste qualified for?

Type 4 powder (20–38μm) supports stencil printing down to 0.4mm pitch, including 0201, 0402, and 0603 passives, BGA, CSP, QFN, and other fine-pitch and bottom-terminated components. Widely used in automotive, medical, and aerospace SMT assembly.

Why does solder paste require overnight shipping?

Solder paste is temperature-sensitive and must be shipped and stored refrigerated (2–10°C) to preserve flux activity, viscosity, and shelf life. Refrigerate immediately upon receipt and allow to reach room temperature before opening and use.