Indium 8.9HF1 Solder Paste PASTEOT-800596-600G Lead Free SAC305 | 600g

Indium 8.9HF1 Solder Paste, SAC305 (Indalloy 256), Type 4, No Clean, Halogen-Free, 600g Cartridge (PASTEOT-800596-600G)

Indium 8.9HF1 is a high-performance, no-clean, lead-free solder paste specifically formulated to deliver outstanding voiding performance for bottom-terminated components (BTCs) and unprecedented first-pass yields in in-circuit testing (ICT) and flying-probe testing. Its soft, pliable post-reflow flux residue eliminates the probe contact failures that cause false test failures — reducing rework and accelerating cycle times. Formulated with SAC305 (Indalloy 256) alloy and a high oxidation barrier to prevent graping and head-in-pillow (HiP) defects. Part of Indium Corporation’s Avoid the Void® product family.

Key Specifications

Key Features

• Outstanding BTC voiding minimization — specifically engineered to reduce voids under bottom-terminated components (QFN, LGA, BGA)
• Highest ICT first-pass yields — soft, pliable post-reflow flux residue allows probe penetration without false failures
• Fewer false test failures — faster cycle times and less rework in ICT and flying-probe test environments
• High oxidation barrier — prevents graping and head-in-pillow (HiP) defects during reflow
• Improved coalescence of small deposits — molten solder oxidation barrier prevents further oxidation during reflow
• Excellent print transfer efficiency — consistent deposit volume for fine-pitch and small aperture printing
• Halogen-free — per EN14582 test method for environmentally compliant assembly
• No clean — post-reflow residue does not require cleaning under normal assembly conditions

Ideal Applications

• Bottom-terminated component (BTC/QFN/LGA) assembly requiring low voiding
• High-reliability PCB assembly with ICT or flying-probe test requirements
• Fine-pitch SMT printing with Type 4 powder for small apertures
• Lead-free, no-clean, halogen-free assembly processes
• Automated cartridge dispensing systems

Frequently Asked Questions

Why is 8.9HF1 specifically recommended for BTC components?
Bottom-terminated components like QFN and LGA packages trap flux volatiles under the component during reflow, which can form voids in the solder joint. Indium 8.9HF1 is formulated with flux chemistry optimized to minimize void formation under BTCs — part of Indium’s Avoid the Void® program — resulting in lower void percentages and more reliable solder joints.

How does 8.9HF1 improve ICT first-pass yields?
The post-reflow flux residue from 8.9HF1 is intentionally soft and pliable, which allows ICT and flying-probe test pins to penetrate the residue and make reliable electrical contact with test points. Hard or brittle flux residues from other pastes can cause probe contact failures that register as false test failures, requiring manual re-test or rework. 8.9HF1 eliminates this failure mode.

What is the difference between Type 3 and Type 4 powder?
Powder type refers to the particle size distribution of the solder alloy powder. Type 4 (nominally 20–38 μm) has smaller particles than Type 3 (nominally 25–45 μm), making it better suited for fine-pitch printing with smaller stencil apertures. Type 4 is the standard for most modern SMT assembly processes.

Is 8.9HF1 available in other formats?
Yes — Indium 8.9HF1 is available in multiple formats including jars and cartridges in various sizes. Contact MTE Solutions for availability of other formats and quantities.

Technical Data Sheet (TDS)