Chemtronics CW7250, CircuitWorks Boron Nitride Thermal Paste, 3.4g Syringe

Boron Nitride - 3.4 g (0.12 oz.) syringe

CircuitWorks^® Thermal Paste facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with a heat conductive filler to maintain a positive heat sink seal in electrical/electronic equipment.

Boron Nitride Thermal Paste (CW7250, CW7250KG)

• Provides maximum thermal conductivity with superior dielectric properties
• Silicone free compound will not harden or dry out
• Thermally stable from -99ºF (-73ºC) to 392ºF (200ºC)
• Exceeds MIL-C-47113 for Thermal Conductivity

FEATURES & BENEFITS

• Facilitates heat transfer between circuit components and heat sinks
• Excellent thermal and dielectric properties
• Will not dry out, harden, or melt
• Noncorrosive and nonflammable

Technical Data Sheet

Safety Data Sheet