Chip Quik TS391AX, Thermally Stable Solder Paste, No-Clean Sn63/Pb37 T4 (15g syringe)

WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to: www.P65Warnings.ca.gov

Chip Quik TS [Thermally Stable] Solder Paste No-Clean Sn/Pb in 5cc syringe 15g w/plunger & tip.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn63/Pb37
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Content: 88% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 183C (361F)
Size: 5cc/15g syringe

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use.

Technical Data Sheet

Safety Data Sheet