Botron B3123 Dissipative Three Layer .12 in Rubber ESD Mat 3 ft x 2 ft x 0.12 in with Hardware and Grounding

Botron SKU: B3123
Botron B3123 Dissipative Three Layer .12″ Rubber ESD Mat

Botron B3123 Dissipative Three Layer .12 in Rubber ESD Mat 3 ft x 2 ft x 0.12 in with Hardware and Grounding

Botron SKU: B3123
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Regular price $65.80
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Botron B3123 Dissipative Three Layer .12 in Rubber ESD Mat 3 ft x 2 ft x 0.12 in with Hardware and Grounding

Overview

Botron’s Dissipative Three Layer Rubber ESD Mat is hands down the best choice for a dissipative surface. While most matting relies on a very thin conductive layer (think carbon paper), Botron’s ESD rubber matting is volumetric in its conductive properties, providing a more stable path to ground.

More Than Meets the Eye

  • • Solder Resistant Surface
  • • UV resistant color stability and conductivity
  • • Reversible from Dissipative to Conductive
  • • Non-Skid Backing
  • • Chemical and Abrasion Resistant
  • • Lead-Free RoHS Compliant

Moisture-Lock Technology

Mat will not curl and is guaranteed to lay flat on the work surfaces. Moisture-Lock helps prevent the mat from drying out, cracking, shrinking and elongation.

3-Layer Construction

Botron's exclusive 3-layer construction features an inner foam layer that provides support and stress absorption for accidental drops. A top dissipative rubber layer maintains the perfect surface for ESDS providing a path to ground at or above 35M Ohms. This level of resistance helps control the discharge path when grounded operators are placing and maneuvering static sensitive devices at the workbench.

Superior Electricals

A highly conductive rubber underside gives way for an excellent path to ground. With a volumetric resistance below 1M Ohm, monitoring the grounding path for both conductive properties and its connection to ground make this mat ideal for every ESD Protected Area (EPA). The 3-layer construction also ensures the discharge path does not travel the over the length of the dissipative top surface towards ground, instead through the top dissipative layer to conductive underside.

 Technical Information





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