MG Chemicals 832FX-1.7L, Black Flexible Epoxy, 1.7L 2 Pail Kit, Case of 1 Kit
MG Chemicals 832FX-1.7L — Black Flexible Epoxy | 1.7L 2-Pail Kit | PCB Potting & Encapsulation
MG Chemicals 832FX is a 2-part black flexible epoxy engineered for encapsulation, potting, and protection of printed circuit boards and electronic assemblies in demanding environments. Its very low mixed viscosity (700 cP) allows it to easily penetrate small gaps, cavities, and component-dense areas, while its highly flexible, low-modulus cured state minimizes mechanical stress on components during thermal cycling and vibration. The 1.7L 2-pail kit is ideal for mid-volume production potting operations.
Part Number: 832FX-1.7L | Mix Ratio: 1:1 by volume | Size: 1.7L 2-pail kit | Case of 1 kit.
Specifications
| Part Number | 832FX-1.7L |
| Type | 2-part black flexible epoxy |
| Mix Ratio | 1:1 by volume (Part A : Part B) |
| Net Volume | 1.7L 2-pail kit |
| Mixed Viscosity | 700 cP (very low — self-leveling) |
| Flexibility | Very flexible, low modulus |
| Color | Black |
| Cure | Room temperature or elevated temperature |
| Chemical Resistance | Water, humidity, salt water, fungus, harsh chemicals |
| Substrate Compatibility | Metals, composites, glass, ceramics, many plastics |
| Manufacturer | MG Chemicals |
Key Features
- Highly flexible, low-modulus cure — remains pliable after cure; absorbs mechanical stress from thermal cycling, vibration, and flexing without cracking or delaminating components
- Very low mixed viscosity (700 cP) — self-leveling; penetrates tight spaces, gaps, and component-dense PCB areas for complete encapsulation without voids
- 1:1 mix ratio — easy to meter by volume; compatible with 2-part dispensing equipment and static mix nozzles
- Mid-volume production format — 1.7L pail kit bridges the gap between the 450ml bench kit and the 40L bulk pails for medium-run potting operations
- Excellent environmental sealing — resists water, humidity, salt spray, fungus, and harsh chemicals; suitable for outdoor, marine, and industrial assemblies
- Electrical insulation & ESD protection — provides electrical isolation for sensitive PCB components
- Black color — UV blocking and IP protection for light-sensitive assemblies
Industries & Applications
- Electronics manufacturing — mid-volume PCB potting and encapsulation for moisture, vibration, and contamination protection
- Automotive and transportation — ECUs, sensors, and control modules requiring flexible protection through thermal cycling
- Marine and outdoor — waterproof sealing of electronic assemblies for submersion-rated applications
- Industrial automation — potting of control boards, relays, and sensors in harsh environments
- LED and lighting — flexible encapsulation of LED drivers exposed to heat cycling
Available Sizes
| 832FX-450ML | 450ml 2-bottle kit — bench/prototyping use |
| 832FX-1.7L | 1.7L 2-pail kit — mid-volume production |
| 832FX-40L | 40L 2-pail kit — high-volume production |
Frequently Asked Questions
What makes 832FX different from standard rigid epoxies?
832FX is a flexible, low-modulus epoxy that remains pliable after cure rather than becoming hard and brittle. This is critical for applications involving thermal cycling, vibration, or mechanical flex, where a rigid epoxy would crack or delaminate over time.
Is 832FX-1.7L compatible with dispensing equipment?
Yes — the 1:1 mix ratio is compatible with most 2-part metering and dispensing systems. The pail format is well-suited for bench-top dispensers and semi-automated potting lines used in mid-volume production.
Can 832FX be used for waterproofing and submersion?
Yes — 832FX provides extreme resistance to water and humidity, including submersion applications. It creates a complete waterproof encapsulant around components and assemblies for outdoor, marine, and wash-down environments.
How does the 1.7L kit compare to the 450ml and 40L options?
The 832FX-1.7L kit is the mid-volume option — larger than the 450ml 2-bottle bench kit but more manageable than the 40L bulk pails. It’s ideal for production environments potting dozens to hundreds of assemblies per run without committing to full bulk quantities.
