Chip Quik TS391LT, Thermally Stable Solder Paste, No-Clean Sn42/Bi57.6/Ag0.4 T4 (15g syringe)

Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free Sn/Bi/Ag in 5cc syringe 15g w/plunger & tip.
Revolutionary Formula: No Refrigeration Required!

Specifications
Alloy: Sn42/Bi57.6/Ag0.4
Flux Type: Synthetic No-Clean
Flux Classification: ROL0
Metal Content: 87% metal by weight.
Particle Size: T4 (20-38 microns)
Melting Point: 138C (281F)
Size: 5cc/15g syringe

Shelf Life
Refrigerated >12 months, unrefrigerated >12 months

Stencil Life
>12 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use.

Technical Data Sheet

Safety Data Sheet