Product Description:

Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid.

Length: 10'

Width: 0.060"

Application: Lugs, Posts, Micro Circuits, SMD Pads, BGA Pads

Color:  Yellow

Flux Type: No-Clean

Material: Copper

RoHS Compliance: Yes

• Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
• Minimizes the risk of damage associated with static electricity
• Patented noncorrosive, halide free, organic no-clean flux
• Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance

Chemtronics Soder-Wick Safety Datasheet