MG Chemicals 8331D-120G, Silver Conductive Epoxy Adhesive, 120g Jar Kit, Case of 1 Kit
MG Chemicals 8331D-120G, Silver Conductive Epoxy Adhesive, 120g Jar Kit, Case of 1 Kit
MG Chemicals 8331D-120G is a silver-filled, two-part electrically conductive epoxy adhesive for permanent electrical connections, circuit repair, and conductive bonding where soldering is unsuitable. Its smooth, non-sagging, thixotropic consistency supports localized application and seam filling. MG identifies 8331D as an improved version of its original 8331 silver epoxy.
This listing supplies one two-jar kit containing Parts A and B, with a combined net weight of 120 g and net volume of 50 mL. These are kit totals, not the contents of each jar.
Best Uses / Applications
- Cold-soldering repairs and conductive trace repair on electronic assemblies.
- Bonding heat-sensitive components where conventional soldering is unsuitable.
- Conductive connections to glass, soft metals, plastics, and other qualified substrates.
- EMI/RFI shielding seam filling between metal plates and enclosure parts.
- Repeated bench repair, prototyping, or assembly work requiring a larger kit than the 8331D-14G syringe format.
- Conductive thermal bonding where electrical conduction is acceptable; prevent adhesive spread that could cause shorts.
Key Features
- Silver-filled epoxy provides electrical conduction and mechanical bonding.
- Smooth, non-sagging, thixotropic consistency.
- Room-temperature cure with optional accelerated heat-cure schedules.
- Good adhesion to many substrates, including metal, wood, glass, and most plastics.
- Manufacturer-listed resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons.
- Room-temperature storage and long shelf life.
- Manufacturer identifies the formulation as SVHC free; consult current documentation for procurement requirements.
Technical Specifications
Values follow the manufacturer TDS dated May 19, 2026. That TDS lists 35 minutes of working time at 22°C; the vendor webpage still displays 20 minutes. Use the instructions applicable to your supplied batch.
| Manufacturer / SKU | MG Chemicals / 8331D-120G |
|---|---|
| Packaging | One two-jar kit, Parts A and B |
| Combined net weight / volume | 120 g / 50 mL |
| Mix ratio, A:B by weight | 1.1:1 |
| Mix ratio, A:B by volume | 1:1 |
| Working time at 22°C | 35 minutes |
| Set time at 22°C | 40 minutes; not full cure |
| Cure schedules | 6 hours at room temperature; alternatively 10 minutes at 65°C or 5 minutes at 80°C |
| Cured resistivity | 1.8 × 10-3 Ω·cm, ASTM D257 |
| Service temperature range | -50 to 150°C |
| Thermal conductivity at 25°C | 1.5 W/(m·K) |
| Cured color / hardness | Silver grey / 78 Shore D |
| Tensile / compressive strength | 13 / 69 N/mm² |
| Lap shear strength | 5.6 N/mm² on stainless steel; 5.1 N/mm² on aluminum |
| Storage | 16–27°C, dry, away from sunlight; recap firmly |
| Listed shelf life | 3 years under specified storage conditions |
Jar-Kit Preparation, Mixing & Cure
Read the kit SDS before use. The TDS recommends cleaning the substrate with isopropyl alcohol, MG 824, to remove oils, dust, and residues; confirm substrate compatibility first. Stir each jar separately to reincorporate material that may have separated. Measure 1.1 parts A to 1 part B by weight, mix thoroughly, and apply to the intended area. If measuring by volume instead, the ratio is 1:1. Do not confuse the weight and volume ratios.
Keep the two components separate until mixing and recap the jars firmly after use. Choose a cure schedule compatible with the entire assembly. Set time is not full cure. Qualify the completed connection for electrical, mechanical, and temperature requirements before service.
Format & Product Comparison
| Option | Format / distinction | Selection consideration |
|---|---|---|
| 8331D-120G | Two-jar kit, 120 g / 50 mL | Larger quantity for repeated work; this listing |
| 8331D-14G | Two-syringe kit, 14.4 g / 6 mL | Smaller repairs and localized dispensing with the same formulation |
| 8330D | Higher-fill conductive epoxy | MG recommends it when maximizing conductivity is the priority |
| 8331S | Different conductive epoxy formulation | MG recommends it for longer working time; use its own TDS |
| Conductive paint | Coating, not bonding adhesive | Broad-area shielding rather than epoxy seam filling |
Frequently Asked Questions
Is 8331D-120G still a kit?
Yes. It is one two-jar kit containing Parts A and B, not a single premixed jar.
Does each jar contain 120 g?
No. The combined net weight is 120 g and the combined net volume is 50 mL.
How do I mix the jar kit?
Stir each part separately, then measure 1.1 parts A to 1 part B by weight and mix thoroughly. The alternative volume ratio is 1:1. Equal weights are not the specified ratio.
Is working time 20 or 35 minutes?
The May 19, 2026 TDS lists 35 minutes at 22°C. The vendor webpage still lists 20 minutes. This page uses the dated TDS; confirm the applicable instructions for your supplied batch when timing is critical.
How long does it take to cure?
The TDS lists 6 hours at room temperature, 10 minutes at 65°C, or 5 minutes at 80°C. The listed 40-minute set time at 22°C is not full cure.
Can it replace solder?
It can provide conductive bonding where soldering is unsuitable, including heat-sensitive components and certain non-solderable substrates. It is not automatically equivalent to a soldered joint; qualify the bond and electrical performance for your application.
Can it fill shielding enclosure seams?
MG identifies seam filling between metal plates as an EMI/RFI shielding application. Actual shielding performance depends on the assembly and must be validated.
Is this adhesive electrically insulating?
No. It is electrically conductive. Avoid contact with adjacent conductors where it could create shorts, and use an electrically insulating adhesive when isolation is required.
How should the jars be stored?
Store at 16–27°C in a dry area away from sunlight, with lids firmly closed. The TDS lists a three-year shelf life under specified conditions.
