Product Highlight - Indium 8.9HF No Clean Solder Paste
Lead-Free Solder Paste Features & Benefits
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for Pb-free assembly. We offer many different alloy choices and flux technologies to solve many of your process challenges.
Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID®. (see below)
AVOID THE VOID®: Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.
Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.)
Looking for an SMT Solder Paste that has Superior Printing and Voiding Performance?
Want enhanced electrical reliability to ensure your product life reliability?
Need it to be stable for room temperature storage and have a long stencil life?
We have your solution!
Indium 8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:
Delivers excellent response-to-pause even after being left on the stencil for 60 hours
Maintains excellent printing and reflow performance after remaining at room temperature for one month
Demonstrates consistent printing performance for up to 12 months when refrigerated
Features:
Halogen-free, Pb-free, no-clean
High transfer efficiency with low variability
Outstanding broadband print transfer
Excellent response-to-pause performance
Unique resilient oxidation barrier technology
Eliminates Head-in-Pillow (HiP) defects
Eliminates graping defects and promotes complete coalescence
Robust reflow capability
Low-voiding with a vast array of thermal profiles and component styles
Wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects
Excellent pin-in-paste printability, solderability, and hole fill
Clear, restricted, encapsulating flux reside with enhanced electrical reliability (SIR/ECM)
Consistent lot-to-lot performance after storage and throughout the assembly process
Backwards compatible with Sn/Pb alloys
Contact MTE Today with any Questions!
