Product Highlight - Indium 8.9HF No Clean Solder Paste

Indium Corporation’s Pb-free solder pastes are ideal for miniaturized components and fine-pitch assembly. They provide first-class printing and robust reflow performance and are all designed to AVOID THE VOID^®. (see below)

AVOID THE VOID^®: Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology.

Indium Corporation’s suite of solder pastes offers formulations designed to deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance.)

Looking for an SMT Solder Paste that has Superior Printing and Voiding Performance?

• Want enhanced electrical reliability to ensure your product life reliability?

• Need it to be stable for room temperature storage and have a long stencil life?

We have your solution!

Indium 8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:

• Delivers excellent response-to-pause even after being left on the stencil for 60 hours

• Maintains excellent printing and reflow performance after remaining at room temperature for one month

• Demonstrates consistent printing performance for up to 12 months when refrigerated

Features:

• Halogen-free, Pb-free, no-clean

• High transfer efficiency with low variability

  • Outstanding broadband print transfer

  • Excellent response-to-pause performance

• Unique resilient oxidation barrier technology

  • Eliminates Head-in-Pillow (HiP) defects

  • Eliminates graping defects and promotes complete coalescence

• Robust reflow capability

  • Low-voiding with a vast array of thermal profiles and component styles

  • Wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects

• Excellent pin-in-paste printability, solderability, and hole fill

• Clear, restricted, encapsulating flux reside with enhanced electrical reliability (SIR/ECM)

• Consistent lot-to-lot performance after storage and throughout the assembly process

• Backwards compatible with Sn/Pb alloys

Contact MTE Today with any Questions!