Mg Chemicals Thermally Conductive Adhesive Epoxy, Fast Cure 8329Tcf-6Ml
MG Chemicals
SKU: 8329TCF-6ML

Mg Chemicals Thermally Conductive Adhesive Epoxy, Fast Cure 8329Tcf-6Ml
MG Chemicals
SKU: 8329TCF-6ML
Regular price$10.25
$10.25
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8329TCF-6ML Fast curing thermally conductive epoxy adhesive. Sold in 2 syringes. 6ml, 0.20 oz
Excellent 1.35 W/(mK) thermal conductivity Easy 1:1 mix ratio Adheres to most electronic substrates Stores and ships at slightly below room temperature no freezing or dry ice required Shelf life of at least one year when stored slightly below room temperature Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
The 8329TCF is used for thermal management situations requiring superior bonding strengths and good thermal transfers. For example, it is used to as a die-attach for electrical and electronics, increasing their long term reliability. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.
Specifications: Specification Test Method Result Physical Properties - Cured Color Visual Dark Grey Density @ 22 C [71 F] 2.38 g/cm3 Hardness (Shore D durometer) 76D Tensile Strength ASTM-D-638 24.4 N/mm2 [3,500 lb/in2] Youngs Modulus ASTM-D-638 7,200 N/mm2 [1,000,000 lb/in2] Elongation ASTM-D-638 1.0% Compression Strength ASTM-D-695 66 N/mm2 [9,600 lb/in2] Lap Shear Strength (Aluminum 5052) ASTM-D-695 5.4 N/mm2 [790 lb/in2] Water Absorption ASTM D 570 2.17% Outgassing (Total Mass Loss) @ 24 h ASTM E 595 1.44% Water Vapor Release (WVR) ASTM E 595 0.16% Collectable Volatile Condensable Material ASTM E 595 0.07% Electrical Properties - Cured Breakdown Voltage @4.188 mm ASTM D 149 39.6 kV Dielectric Strength @4.188 mm ASTM D 149 9.5 kV/mm [240 V/mil] Breakdown Voltage @3.175 mm [1/8] Reference fit 34.2 kV Dielectric Strength @3.175 mm [1/8] 10.8 kV/mm [273 V/mil] Volume Resistivity ASTM D 257 3 x1014 cm Surface Resistivity ASTM D 257 3 x1013 Dielectric Dissipation & Constant dissipation, D constant, k Dissipation & Constant @ 1 kHz ASTM D 150-98 0.022, 6.25 Insulating Yes Conductive No Thermal Properties - Cured Thermal Conductivity ASTM E 1461 @ 25C @ 50C@ 100C 1.35 W/(mK) 1.36 W/(mK)1.22 W/(mK) Heat Deflection Temperature ASTM D 648 40 C [104 F] Glass Transition Temperature (Tg) ASTM D 3418 31 C [88 F] CTE prior Tg ASTM E 831 29 ppm/C CTE after Tg ASTM E 831 134 ppm/C Specific Heat @25 C [77 F] ASTM E 831 1.031 J/(gK) Curing & Work Schedule Working Life 35 min Shelf Life 1 y Min. Service Cure 14 min Full Cure @25 C [77 F] 80 min Full Cure @65 C [149 F] 15 min Temperature Service Range Constant Service Temperature -65 C to 165 C [-40 F to 302 F] Maximum Withstand Temperature -70 C to 200 C [-40 F to 302 F] Storage Temperature of Unmixed Parts 20 C [68 F] Properties of Uncured 8329TCF Physical Properties - Uncured Mixture (1A:1B) Color Dark Grey Density 2.47 g/mL Mix Ratio by volume (A:B) 1:00:1.00 Mix Ratio by weight (A:B) 0.92:1.00 Solids Content (w/w) 100% Physical Properties - Uncured Part A Part B Color Black Light Grey Density 2.45 g/mL 2.47 g/mL Flash Point >149 C [300 F] >148 C [298 F] Viscosity 1,300,000 cP [1,300 Pas] 760,000 cP [760 Pas]