Leaded Solder Paste, Sn63-Pb37, No Clean 500 G (1.1 Lb)

MG Chemicals SKU: 4860P-500g
Leaded Solder Paste, Sn63-Pb37, No Clean 500 G (1.1 Lb)

Leaded Solder Paste, Sn63-Pb37, No Clean 500 G (1.1 Lb)

MG Chemicals SKU: 4860P-500g
Regular price $69.95
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4860P - SN63/PB37 NO CLEAN SOLDER PASTE The 4860P Sn63/Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder blended with a no clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. No clean means that residues are not harmful to assemblies. Applications & Usages The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when using an ultra-fine pitch stencils down to 0.3 mm. Features Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements Flux meets J-STD-004B Non-corrosive Non-conductive residue Halide free Good wettability Type 3 (45-25 µm) Dobb Frank (DRC conflict free) REACH (compliant) RoHS (non-compliant) Catalog Number Size Format 4860P-35G 35 g (1.23 oz) Syringe 4860P-250G 250 g (8.81 oz) Jar 4860P-500G 500 g (1.1 lb) Jar Technical Data Sheet
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