***8610-60g Discontinued, replacement 8616-25ML***Heat Transfer Compound, Type 2, Non-Silicone. Special synthetic base, fortified with metal oxides and compounded to a paste-like consistency for ease of application High efficient thermal conductive properties Means more rapid transfer of heat for longer component life High temperature stability Provides physical properties of low bleed and low evaporation for long-term service in any application that requires Heat Sink Compound.
Benefits of Non Silicone Heat Transfer Compound OVER Silicone No migration and component contamination. Applications Typically, Heat Transfer Compounds (heat sink compounds) are used in OEM Electronic Component Plants to insure fast, accurate heat transfer in electronic components and circuitry Other used: Semiconductor Mounting Devices Thermal joints Ballast heat transfer mediums Power resistor mountings Thermocouple wells Transistor diodes & silicone rectifier base and mounting studs ALL electric and electronic devices where efficient heat transfer cooling through thermal coupling is required
Specifications Physical Properties Test Method Non Silicone 8610 Silicone 860 Appearance Visual Off white / smooth paste White paste Consistency ASTM D 217 310-320 Specific Gravity @ 25C (77F) 2.5 min 2.3 min Bleed % 24 hours @ 200C FTM-321 1.0% max 2.0% max Evaporation 24 hours @ 200C FTM-321 2.0% max 2.0% max Dropping Point ASTM D-566 > 500F (260C) > 500F (260C) Min. operating temp. -40F/-40F 55F/48C Max. operating temp. 200C 200C (consistent) 300C (intermittent) Electrical Properties Test Method Non Silicone 8610 Silicone 860 Thermal Conductivity Hot Wire Method Heat Flow #36 C 0.773 W/mK 0.657 W/mK Dielectric Strength (0.05l gap) ASTM D-149 350 V/MIL 400 V/MIL Dielectric Constant @ 1000 Hz ASTM D- 150 4.4 3.81 Dissipation Factor @ 1000 Hz ASTM D 150 0.0021 0.0032 Resistivity @ 21C ASTM D 150 6.38 x 1013 Ohmcm 1.5 x 1015 Ohmcm