832Ht-375Ml, High Temperature Epoxy Encapsulating And Potting Compound

MG Chemicals SKU: 832HT-375ML
832Ht-375Ml, High Temperature Epoxy Encapsulating And Potting Compound

832Ht-375Ml, High Temperature Epoxy Encapsulating And Potting Compound

MG Chemicals SKU: 832HT-375ML
Regular price $85.35
/
Shipping calculated at checkout.
832-HT, for encapsulating and potting electronics in high temperature environments, aggressive chemical environments, or where improved technology protection is desired. Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics.
Extreme physical strength and chemical resistance Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols Protects against strong vibrations, abrasions, and direct physical impact Extremely difficult to remove - grants incredible technology protection Maximum service temperature of 275C (527F)
Typical Applications Use in electronic assemblies to prevent vibration damage Encapsulate circuits for the purpose of technological protection
Cured Properties - Physical Test Method Result Part A Viscosity at 20 C (68 F) 54,800 cps Part B Viscosity at 20 C (68 F) 11,000 cps Mixed Viscosity at 20 C (68 F) 40,000 cps Mixing Ratio by Volume 2.0 : 1.0 (Part A: Part B) Mixing Ratio by Mass 2.186 : 1.000 (Part A: Part B) Maximum Service Temperature 275 C (527 F) Maximum Intermittent Temperature 300 C (572 F) Working Time (100 gram sample) 1 hour Hardness, Shore D 80 Tensile Strength ASTM-D-638-02a 7,861 PSI Elongation ASTM-D-638-02a 3.38% Compressive Strength ASTM-D-695-02a 11,870 PSI Flexural Strength ASTM-D-790-03 14,600 PSI Flexural Modulus ASTM-D-790-03 399,000 PSI Lap Shear Strength ASTM-D-1002-01 1,794 PSI Coefficient of Thermal Expansion ASTM-D-648-01 -40 C to 50 C 75.7x10-6 mm/mmC +100 C to +250 C 154.0x10-6 mm/mmC -40 C to +250 C 125.3x10-6 mm/mmC +25 C to + 250 C 140.2x10-6 mm/mmC Deflection Temperature Under Load ASTM-D-648-01 53.9 C (129.02 F) Thermal Conductivity ASTM-E-1530-99 0.210 W/mK Thermal Conductivity @ 25 C (77F) ASTM-E-1461-92 0.218 W /mK Thermal Diffusivity @ 25 C (77 F) ASTM-E-1461-92 1.33 x 10-13 M2/s Specific Heat Capacity @ 25 C (77 F) ASTM-E-1269-01 1419 J/kgK Curing Time (100g) @ room temp. 24 hours @ 65C 60 minutes @ 80C 45 minutes @ 100C 35 minutes @ 130C 25 minutes @ 160C 15 minutes @ 200C 10 minutes Cured Properties - Electrical Test Method Result Corrected Dissipation Factor, D ASTM D150-98 0.007 @ 1KHz 0.011 @ 10KHz 0.014 @ 100KHz 0.014 @ 1MKHz Dielectric Constant ASTM D150-98 4.24 @ 60Hz 2.96 @ 1KHz 2.81 @ 10KHz 2.83 @ 100KHz 2.83 @ 1MKHz Dissipation Factor ASTM-D-150-98 0.0018 @ 60 Hz Volume Resistivity ASTM-D-257-99 9.3 x 1015 ohm cm Surface Resistivity ASTM-D-257-99 5.3 x 1013 ohm Dielectric Strength ASTM D149-97a 1,138 V/mill @ 0.020 ASTM D149-97a 326 V/mil @ 0.017 Breakdown Voltage ASTM D149-97a 54.4 kV
Recently viewed