8321C-320Ml, Optically Clear Epoxy Encapsulating And Potting Compound

SKU: 8321C-320ML
8321C-320Ml, Optically Clear Epoxy Encapsulating And Potting Compound

8321C-320Ml, Optically Clear Epoxy Encapsulating And Potting Compound

SKU: 8321C-320ML
Regular price $62.72
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Optically Clear Epoxy Encapsulating and Potting Compound, 8321-C
Water clear potting Non-porous, water and chemical resistant Extremely impact resistant Electrically isolative RoHS Compliant
Specifications Uncured Properties - Resin [Part A] Viscosity @ 25C Brookfield 30 RPM 900 cps Specific Gravity 1.14 Color Optically Clear Uncured Properties - Hardener [Part B] Viscosity @ 25C Brookfield 30 RPM 10 cps Specific Gravity 0.946 Color Optically Clear Uncured Properties Mixed Viscosity @ 25C Brookfield 30 RPM 10 cps Specific Gravity 1.09 Color Optically Clear Mixing Properties - Uncured Volume Mixing Ratio 3.0 (resin): 1 (hardener) Mass Mixing Ratio 3.6 (resin): 1 (hardener) Curing Schedule Curing Time (100 g) @ room temperature 48 hours @ 80C / 176 F 2 hours Working time 2 - 3 hours Cured Properties - Physical Hardness (shore D) 76-78 Compression Strength ASTM D695 935 kg/cm2 Flexual Strength ASTM D790 871 kg/cm2 Lap Shear Strength ASTM D1002 41.5 kg/cm2 Cured Properties - Electrical Surface Resistivity @ 24C/30%RH ASTM D257 > 1 x 1017 Ohms/square Volume Resistivity @ 24C/30%RH ASTM D257 2 x 1016 Ohmscm Dielectric Strength ASTM D149-09 436 V/mil @ 0.139" thickness Dielectric constant, K/ Dissipation Factor, D ASTM D150-98 @ 60 Hz 3.37 / 0.012 @ 1 KHz 3.33 / 0.011 @ 10 KHz 3.27 / 0.014 @ 100 KHz 3.19 / 0.017 @ 1 MHz 3.13 / 0.019 Breakdown Voltage ASTM D149-09 60.6 kV @ 0.139" thickness Cured Properties - Thermal Glass Transition Temperature (Tg) by DSC ASTM D3418 41 C / 105.8 F Coefficient of thermal expansion ASTM E831 CTE @ 25C 83.0 m/m/C CTE @ 100C 236 m/m/C Cured Properties - Reflectance Total Reflectance in the 350-700 nm Range 10%

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