96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.
Lead free Complies with RoHS Exceeds the impurity requirements of J-Std-006 No Clean flux 21 Gauge, 0.032" diameters Excellent wettability Hard non-conductive residues 1 lb of lead free solder has 27% more length than leaded solder
Flux Percentage M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%. Flux Core A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, please visit the following link for a list of Flux Removers:
Specifications Test Method Specification Ag content 2.8-3.2% Cu content 0.3-0.7 % Sn content Balance Flux Classification JSTD-004 REL0 Copper Mirror IPC-TM-650 2.3.32 No removal of copper film Silver Chromate IPC-TM-650 2.3.33 Pass Corrosion IPC-TM-650 2.6.15 Pass SIR JSTD-004,Pattern Down IPC-TM-650 18.104.22.168 2.33 x 10 11 ohms SIR Bellcore (Telecordia) Bellcore GR-78-CORE 13.1.3 6.12 x 10 11 ohms Electromigration Bellcore GR-78-CORE 13.1.4 Pass Post Reflow Flux Residue TGA Analysis 55% Acid Value IPC-TM-650 2.3.13 190-210 Flux Residue Dryness IPC-TM-650 2.4.47 Pass Spitting of Flux-Cored Solder IPC-TM-650 2.4.48 0.3% Solder Spread IPC-TM-650 2.4.46 130 mm2 Lead free/leaded solder comparison Lead Free Solder (Sn/Ag/Cu) Sn63/Pb37 (Leaded Solder) Melting Point 217-221 C (422.6 - 429.8 F) 183 C (361.4 F) Wire Diameter 0.032 (0.81 mm) 0.032 (0.81 mm) Std. Wire Gauge 21 21 Tolerance, in. +/- 0.002 +/- 0.002 Hardness, Brinell 15HB 14HB Coefficient of Thermal Expansion Pure Sn=23.5 24.7 Tensile Strength 4312 psi 4442 psi Density 7.39 g/cc 8.42 g/cc Electrical Resistivity 13.0 ohm-cm 14.5 ohm-cm Electrical Conductivity 16.6 %IACS 11.9 %IACS Yield Strength, psi 3724 3950 Total Elongation,% 27 48 Joint Shear Strength, at 0.1mm/min 20C 17 14 Creep Strength, N/mm2 at 0.1mm/min 20C 13.0 3.3 Creep Strength, N/mm2 at 0.1mm/min 100 C 5 1 Thermal Conductivity, 58.7 W/m * K 50.9 W/m * K