MG Chemicals 8329TFS-25ML, Slow Cure Thermally Conductive Adhesive, 25ml Dual Syringe, Case of 6

This thermally conductive adhesive is a 2-part, heat-cured epoxy adhesive with a 4-hour working time. It is dark grey, smooth, thixotropic, and bonds well to a wide variety of substances.

Use this thermally conductive adhesive to glue heat sinks to LEDs, CPUs, and other heat-generating components. It is viscous, yet flowable enough to be dispensed from a syringe, and the 50ml size may be used with a mixing tip when dispensed with a caulking gun or pressurized system.

This adhesive has been formulated to have a long working time.

• Thermal conductivity of 1.2 W/(m·K)
• 1:1 mix ratio
• Working time: 4 hours
• Cure time: 80 minutes at 80 °C (176 °F)
• Provides strong electrical insulation
• High compressive strength
• Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons

Technical Data Sheet

Safety Data Sheet